Acquired Electronics360

Aerospace

System-on-Chip Brings Bluetooth® 4.2 Performance to Wearables, IoT Products

08 November 2016

EM9304 system-on-chip. Source: EM Microelectronic. EM9304 system-on-chip. Source: EM Microelectronic.
EM Microelectronic has announced the EM9304, a tiny, low-power, system-on-chip (SoC) optimized for Bluetooth® v4.2 low-energy-enabled IoT, wearable and smart electronics products.

The EM9304 is architected for flexible usage in various Bluetooth® low- energy (BLE) applications. For simple applications such as beacons or smart-sensing wearables, the EM9304 can be used standalone or connected to various sensors with standard serial interfaces. Users can also take advantage of a powerful yet low-power 32-bit processor with a floating-point-unit and on-chip NVM. Alternatively the EM9304 can be connected with a standard MCU or custom ASIC for customers requiring just a simple and easy-to-implement BLE add-on function to existing applications.

The EM9304 is reportedly the smallest BLE v4.2 SoC available on the market, featuring a 2.4 GHz transceiver with state-of-the-art receiver sensitivity, and programmable transmit power for optimized current consumption. The EM9304 includes an on-chip power management system with automatic configuration for 1.5 V or 3 V batteries. It is compatible with standard 1.5 V MCUs, such as ultra-low-power watch microprocessors from EM Microelectronic, or with standard 3 V microprocessors from many vendors. The EM9304 comes with 128 kB OTP for applications, 48 kB RAM to support application development, and up to 20 kB RAM of retention data RAM.

Hardware and software development kits are available now, including commercially available tools with an IDE and debugger. A website and forum are available to help customers with their development, including hardware and firmware examples. QFN samples are available now and full production will be in early 2017. Customer support for PCB design and FCC/CE certification are available.



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Nov-01 Dec 2017 Helsinki, Finland
23-27 Apr 2018 Oklahoma City, Oklahoma
18-22 Jun 2018 Honolulu, Hawaii
Find Free Electronics Datasheets
Advertisement