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Aerospace

High-Speed Connector Supports High-Speed Data

19 July 2016

Molex has updated its NeoScale™ High-Speed Mezzanine System to deliver faster data rates and improve performance. Offering clean signal integrity at data rates of 56 Gbps NRZ, the modular mezzanine interconnect is ideal for high-density printed circuit board (PCB) applications with limited real estate. Applications include enterprise networking towers, telecommunication hubs and servers, industrial controllers, and medical and aerospace or defense high-data-rate scanning equipment.

NeoScale™ High-Speed Mezzanine System. Source: Molex NeoScale™ High-Speed Mezzanine System. Source: Molex

Composed of a vertical plug and vertical receptacle, the NeoScale High-Speed Mezzanine System features a patented modular triad wafer design that enables customizable PCB routing in high-density applications. The system’s patented Solder Charge Technology™ PCB attachment method delivers robust solder joints. Designers can choose among 85 Ohm, 100 Ohm, power triads and low-speed signals to build a mezzanine solution that meets their requirements. The connector design can also be blind mateable with rugged triads for multiple connectors.

The modular NeoScale™ triad wafer is composed of three pins per differential pair—two signal pins and one shield pin. Each triad is a standalone, shielded, 56-Gbps-capable differential pair or an 8 A power feed. Triads can be optimized for signals supporting high-speed 85 Ohm or 100 Ohm differential pairs, high-speed single-ended transmissions, low-speed single-ended or control signals, and power pins.

Other mezzanine options offer high-speed differential pairs either at 90 to 92 Ohms to accommodate the 85 to 100 Ohm range, or they offer mezzanine options with only 85 or 100 Ohm options. The NeoScale™ High-Speed Mezzanine System allows designers to run 85 and 100 Ohm high-speed signals through one connector. In addition, low-speed, single-ended signals (three signals per triad) and power (8 A per triad) can be utilized.

The system’s honeycomb housing routes each triad to minimize crosstalk and effectively route out of the PCB in one or two layers, reducing the need for PCB real estate. In addition, unique “pillar of strength” structures in the housing protect the mating interface and flexible contacts to help prevent terminal damage.

The NeoScale™ High-Speed Mezzanine System is available in 12 to 42 mm stack heights; circuit sizes of 8 to 300 triad wafers in 2-, 4-, 6-, 8- and 10-row configurations; and 85 or 100 Ohm impedance to provide optimal design flexibility. Customized versions are also available, such as 10 and 45 mm stack heights.



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