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Semiconductors and Components

Amkor Expands MEMS Packaging in China

28 June 2016

Test and packaging house Amkor is ramping up its microelectromechanical systems (MEMS) and sensor packaging line at its facility in Shanghai, China.

The expansion to the China facility is another step for Amkor’s MEMS business, which already has a packaging line in the Philippines that has produced more than 2.1 billion units of MEMS and sensors since 2011.

The MEMS and sensor line in Shanghai will use a standard strip-based process and test protocols to speed up time-to-market, Amkor says.

As MEMS and sensor content grows in smartphones, the Internet of Things devices and smart cars, the need for miniaturization and advanced packaging is becoming important in order for the MEMS market to continue to grow. Amkor says the new MEMS service in Shanghai will allow the company to better serve its customers in China and internationally.

To contact the author of this article, email engineering360editors@ihs.com

To contact the author of this article, email Peter.Brown@ieeeglobalspec.com


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