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Aerospace

Optical Backplane Interconnect Complies With VITA Standards

20 June 2016

TE Connectivity (TE) has announced its Ruggedized Optical Backplane interconnect systems that provide a high-density, blind-mate optical interconnect in a backplane/daughter card configuration. The half-sized connectors are fully compliant to the ANSI/VITA 66.4 standard.

Ruggedized optical backplane interconnect system. Source: TE Connectivity   Ruggedized optical backplane interconnect system. Source: TE Connectivity

The fiber optic ribbon cable interconnect feeds through the backplane to removable system modules using MT ferrules. The VITA 66.1 modules are full width and accommodate two MT ferrules, and the VITA 66.4 modules are half width and hold a single MT ferrule. Two VITE 66.4 modules can fit into the same space as a VITA 66.1 module.

Designed for rugged embedded computing applications, the optical modules are compatible with VPX and other high-performance standards. The protective cover is made of anti-static material, and the connector mounting screws contain a pre-applied anti-vibration material to help withstand vibration. The modules have an operating temperature range of –20° C to 85° C and can withstand 100 cycles, as tested per EIA-455-21.



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