Fujipoly® has introduced a line of high performance, glass fabric reinforced thermal interface materials. Sarcon® GAR thin films deliver a high thermal conductivity (3.0 W/m°K) while exhibiting a thermal resistance as low as .17 °Cin2/W.
The reinforced film is a great choice for complex die-cut shapes and exerts a low force on components as it fills near‐microscopic air gaps between the heatsink and board-level heat sources. This dramatically increases surface contact and measurably improves the cooling performance of the heatsink.
Fujipoly’s® V‐0 equivalent thin film is recommended for applications with operational temperatures that range from ‐40° C to +150° C. Sarcon® GAR comes in three thicknesses (0.2, 0.3, and 0.45 mm) and is offered in rolls, pre-cut sheets or can be die-cut to the exact shape required.