Acquired Electronics360

Mobile Devices

Teardown: Sony Xperia M5

08 March 2016
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

The Sony Xperia M5 offers full HD 5” display with BRAVIA, 21.5 MP main camera and 13 MP, 64-bit MediaTek Helio X10 Octa-core processor, Waterproof, dust-tight and durable (IP65/68) and up to 2 days battery life and Battery STAMINA Mode.

Summary points:

Sony's Smartphone with 16GB eMMC and 3GB DDR3 SDRAM

Android OS v5.0 Lollipop

MediaTek Apps/Baseband, Octa-Core, MT6795W

5" IPS LCD, 1920 x 1080 Pixels, 441 ppi with In-Cell Touch

21MP Primary Camera with 13.1MP Secondary Camera

Target market: Mass Market

Released: 3Q2015

Pricing: $439 USD

Availability: Worldwide

Total cost (direct materials and manufacturing): $145.60

Major Components:

5" Diagonal, TFT LCD, LTPS, IPS, 1920 x 1080, In-Cell Touch - MFG: JAPAN DISPLAY INC - (Qty: 1)

Primary Camera Module, 21MP, BSI Stacked CMOS(Exmor RS), 1/2.4" Format, Auto Focus Lens - (Qty: 1)

SDRAM, Mobile DDR3-1866, 3GB, PoP - MFG: MICRON TECHNOLOGY INC - MPN: EDFP164A3PD-JD-F - (Qty: 1)

Apps / Baseband Processor, Multi-Mode, Multi-Band, Helio X10, Octa-Core A53 with 64-Bit Support, IMG G6200 GPU, 28nm, PoP - MFG: MEDIATEK INC - MPN: MT6795W - (Qty: 1)

10-Layer, FR4/RCF HDI, Any Layer Stacked Via - MFG: HONGHENGSHENG ELECTRONICAL TECHNOLOGY - (Qty: 1)

Secondary Camera Module, 13.13MP, BSI Stacked CMOS(Exmor RS), 1/3.06" Format, Auto Focus Lens - (Qty: 1)

Enclosure, Main, Top, Injection Molded Plastic, Painted, w/ Insert-Molded Stamped / Formed Stainless Steel, 1 Brass Insert & 9 Threaded Metal Inserts - (Qty: 1)

Flash, eMMC NAND, 16GB - MFG: TOSHIBA SEMICONDUCTOR - MPN: THGBMFG7C2LBAIL - (Qty: 1)

Power Management IC - MFG: MEDIATEK INC - MPN: MT6331P - (Qty: 1)

Battery Pack, Li-Polymer, 1-Cell, 3.8V, 2600mAh, 9.9Wh, w/ Flex PCB & Board to Board Connector - MFG: LG CHEM LTD - (Qty: 1)

Device BreakdownDevice Breakdown

Device OverviewDevice Overview

Primary Camera ModulePrimary Camera Module

Main PCB TopMain PCB Top



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04-09 Jun 2017 Honolulu, Hawaii, USA
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