Acquired Electronics360

Mobile Devices

Teardown: Apple - iPhone 6S (A1688)

23 December 2015
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Apple - iPhone 6S (A1688)

The iPhone 6S has 3D Touch that senses how deeply a user presses the display, which is designed to let the user do all kinds of essential things more quickly and simply. The iPhone offers a 12-megapixel iSight camera and takes 4K video, up to four times the resolution of 1080p HD video. It is powered by the custom-designed 64-bit A9 chip.

Summary points:

  • Apple Application Processor, 64bit dual-core, 14nm A9/APL0898
  • 16GB eMMC and 2GB DDR4 SDRAM
  • Qualcomm Baseband, 20nm, MDM9635M
  • 4.7" IPS LCD Display, In-Cell Touch w/3D Touch, 1334 x 750
  • Fingerprint Sensor with Sapphire Crystal Glass

Target market: Consumer / Mass Market

Released: September 2015

Pricing: $649 USD

Availability: Global

Total cost (direct materials and manufacturing): $183.58

Major Components:

- 4.7" Diagonal, TFT LCD, LTPS, IPS, 1334 x 750, In-Cell Touch, Integrated Touchscreen Controller Module, Integrated 3D Touch Controller & PCB - MFG: JAPAN DISPLAY INC - (Qty: 1)

- Application Processor, Dual-Core ARMv8-A 64-bit 1.85GHz CPU, GT7600 6 Core GPU, 14nm, PoP - MFG: APPLE INC - MPN: APL0898 - (Qty: 1)

- SDRAM, Mobile DDR4, 2GB, PoP - MFG: SAMSUNG SEMICONDUCTOR INC - MPN: K3RG1G10BM-BGCH - (Qty: 1)

- Baseband Processor, Multi-Mode, GSM/EDGE/CDMA2000 1x EVDO/TD-SCDMA/HSPA+/LTE Cat 6, 20nm, w/ Carrier Aggregation - MFG: QUALCOMM - MPN: MDM9635M - (Qty: 1)

- Enclosure, Main, Bottom, Machined Aluminum, Anodized, 2-Pieces, w/ Injection Molded Plastic, w/ 34 Spot-Welded Points & 32 Pressed-In Threaded Metal Inserts, Printed - (Qty: 1)

- Primary Camera Module, 12MP, BSI CMOS, 1/3" Format, Auto Focus Lens - (Qty: 1)

- 10-Layer, FR4/RCF HDI, Any Layer Stacked Via, Lead-Free - MFG: COMPEQ MANUFACTURING CO LTD - (Qty: 1)

- Fingerprint Sensor Module, Area Type, w/ Sapphire Crystal Cover, w/ Machined Metal Frame - (Qty: 1)

- Flash, eMMC NAND, 16GB - MFG: TOSHIBA SEMICONDUCTOR - MPN: THGBX5G7D2KLFXG - (Qty: 1)

Device BreakdownDevice Breakdown

Device OverviewDevice Overview

Main PCB TopMain PCB Top

Main PCB BottomMain PCB Bottom



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