Acquired Electronics360

Power Semiconductors

Micromodule Regulator Allows Current Sharing Up to 144 A

10 December 2015

Linear Technology Corp.’s newest power module LTM4677 is a dual 18 A or single 36 A step-down DC/DC μModule regulator with PMBus serial interface for autonomous digital power system management. The digital interface enables system designers and remote operators to control and supervise a system’s power condition and consumption via an I2C bus with READ and WRITE commands.

μModule regulator offers PMBus digital interfaceμModule regulator offers PMBus digital interface

Its two 18 A outputs can current share to provide up to 36 A single output. For higher current output, as many as four LTM4677 regulators can be paralleled to deliver up to 144 A output. Also, the μModule regulator is designed to current share with non-PMBus interfaced regulators such as the 26 A LTM4620 and the 36 A LTM4630. In addition, LTM4677 is also pin compatible with lower power versions, such as LTM4675 (9A, 9A) and LTM4676A (13A, 13A). Along with pin compatibility, the lower power versions are also 100% functional alternatives, eliminating the need to change circuit board layout during system prototyping.

The LTM4677 regulator is designed to offer fast, dual analog control loops with precision mixed-signal circuitry. Housed in a 16 mm x 16 mm x 5.01 mm BGA package, LTM4677 includes EEPROM, I2C interface, dual DC/DC controller, power MOSFETs, inductors and supporting components. The input voltage range is 4.5 V to 16 V and the output range is 0.5 V to 1.8 V. Likewise, the internal operating temperature range for the μModule regulator is from 40 °C to 125°C.

Target applications include optical data transport systems, datacom and telecom switches and routers, industrial test equipment, robotics, RAID and enterprise systems where the cost of electricity, cooling and maintenance are critical and must be continuously and precisely measured.

In quantities of 1,000, LTM4677 is priced at $39.60 each.



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Nov-01 Dec 2017 Helsinki, Finland
23-27 Apr 2018 Oklahoma City, Oklahoma
18-22 Jun 2018 Honolulu, Hawaii
Find Free Electronics Datasheets
Advertisement