Acquired Electronics360

Mobile Devices

Teardown: Huawei Honor 6

24 November 2015
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

The Huawei Honor 6 features a 5-inch 1080 x 1920-pixel Full HD display, a Kirin 920 processor, 3GB of RAM, a 13MP camera and a secondary 5MP one.

Summary points:

  • Flagship Huawei phone aimed at Galaxy and iPhone segment
  • Sells much cheaper than iPhone (50% of price)
  • 5" 1080 x 1920 display with in-cell touch
  • HiSilicon Kirin 920 Quad-core ARM Cortex A15 / 1.7GHz CPU

Target market: Consumer/ Mass Market

Released: Q3 2014

Pricing: about $300 or more

Availability: Global (Primarily China)

Total cost (direct materials and manufacturing): $153.21

Major Components:

- Display Module, 4.95" Diagonal, 16.7M Colors (IPS Mode), In-Cell Touch, 1080 x 1920 Pixels, 441 ppi, 15.7 g - MFG: JAPAN DISPLAY INC - (Qty: 1)

- Apps / Baseband Processor, Multi-Mode, Kirin 920, Quad-Core ARM Cortex-A15 1.7GHz CPU, Quad-Core ARM Cortex-A7 1.3GHz CPU, Mali-T628 MP4 GPU, 28nm, PoP - MFG: HISILICON - MPN:

Hi3630 - (Qty: 1)

- SDRAM, Mobile DDR3-1860, 3GB, PoP - MFG: SAMSUNG SEMICONDUCTOR INC - MPN: K3QF6F60MM-QGCF - (Qty: 1)

- Primary Camera Module, 13MP, BSI CMOS, 1/3" Format, Auto Focus Lens - (Qty: 1)

- 10-Layer, FR4/RCF HDI, 3+4+3, Lead-Free - MFG: UNIMICRON TECHNOLOGY CORP - (Qty: 1)

- Flash, eMMC NAND, 16GB, MLC - MFG: TOSHIBA SEMICONDUCTOR - MPN: THGBMAG7A2JBAIR - (Qty: 1)

- RF Transceiver, Multi-Mode, Multi-Band, GSM/EDGE/TD-SCDMA/WCDMA/LTE/TD-LTE - MFG: HISILICON - MPN: Hi6361 - (Qty: 2)

- Battery Pack, Li-Polymer, 3.8V, 3000mAh, 11.4Wh, w/ Integral Flex PCB & Board to Board Connector - MPN: HB4242B4EBW - (Qty: 1)

- Secondary Camera Module, 5MP, BSI CMOS, 1/4" Format, Fixed Lens - (Qty: 1)

- PAM, Quad-Band GSM/EDGE, Penta-Band WCDMA / HSPA+ / LTE - MFG: TRIQUINT SEMICONDUCTOR INC - MPN: TQP9058H - (Qty: 1)

Device overviewDevice overview

Main PCB TopMain PCB Top

Main PCB BottomMain PCB Bottom



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