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Electronics and Semiconductors

Allegro MicroSystems Unveils 2-D Speed and Direction Sensor IC

05 November 2015

Allegro MicroSystems has introduced the A1262 dual-channel Hall-effect latch. The device features 2-D sensing using vertical Hall and planar Hall elements, enabling 90° phase separation between channels independent of ring magnet geometry. Designers can achieve configurations that are currently not possible with traditional planar Hall sensors such as the replacement of through-hole SIP devices with small surface-mount SOT23 ICs that save space and cost.

The device targets automotive, industrial and consumer markets such as motor commutation and rotary position sensing such as window blinds, garage door openers, scroll wheels, power window lifts, sunroof/sliding door/trunk/tailgate motors and white goods.

It has two options that feature a planar Hall element that is sensitive to magnetic fields perpendicular to the face of the package (Z). According to Allegro, the other channel comes from a vertical Hall element that is sensitive in either the X or Y direction, and the Y option features a vertical Hall plate that is sensitive to magnetic fields parallel with the face of the package across the leaded edges of the package. The X option features a vertical Hall plate sensitive to magnetic fields parallel with the face of the package across the leadless edges of the package, with a lower total effective air gap than from competing solutions.

Moreover, it includes two Hall plates; a multiplexer, small-signal amplifier, chopper stabilization, a Schmitt trigger, and two short-circuit-protected NMOS output transistors. An on-board regulator allows operation with supply voltages of 3 to 24 V and adds EMC robustness for protection against high voltage transient events.

The A1262 is AEC-Q100 standards qualified and includes Zener clamps, output short-circuit protection and reverse-battery protection. High-temperature performance is achieved through dynamic offset cancellation that reduces the offset voltage caused by device over molding, temperature dependencies and thermal stress.

To contact the author of this article, email engineering360editors@ihs.com



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