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Semiconductor Value Chain

TSMC and Dolphin Team for Internet of Things Subsystems

11 August 2015

Foundry leader Taiwan Semiconductor Manufacturing Co. (TSMC) and Dolphin Integration are collaborating on low-power system-on-chip (SoC) subsystems for the Internet of Things (IoT).

Under the deal, Dolphin is introducing SoC designs using TSMCs ultra-low power technology with integrated low power panoply (LoPan), dynamic management of power regulators, consistent clock and voltage domains and configurable synchronous control networks.

TSMC says IoT designs require ultra-low power with a shortened time-to-market as well as a need to reduce design methodology complexity to simply silicon intellectual property component integration. The deal with Dolphin will allow designers to meet these demands in an ever-expanding IoT and consumer device market, the company says.

TSMC and Dolphin will be providing an ultra-low power demo chip using TSMC 55nm process technology as well as subsystem reference designs and packaging options for engineers to begin early work on SoC subsystems for future IoT applications.

Questions or comments on this story? Contact engineering360editors@ihs.com

Related links:

www.tsmc.com

IHS Semiconductor Manufacturing

News articles:

Cadence Receives Certification for TSMC’s 16nm FinFET Process

Xilinx, TSMC Team for 7nm Process Technology

TSMC Adding Near-threshold Voltage Operation at 16nm

TSMC Aims for 7nm in 2017

TSMC Certifies Mentor, Synopsys for 10nm FinFET Design



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