Acquired Electronics360

Semiconductors and Components

Toshiba Launches Tablet and Smartphone Image Sensors

07 August 2015

Toshiba America Electronic Components Inc. (TAEC) has introduced a pair of 16 megapixel (MP)CMOS image sensors targeted at smartphones and tablets.

Toshiba: 8 Megapixel CMOS image sensor dubbed the T4KA3 for smartphones and tablets. Source: Toshiba.comToshiba: 8 Megapixel CMOS image sensor dubbed the T4KA3 for smartphones and tablets. Source: Toshiba.comThe two image sensors are the first 16 MP CMOS chips from TAEC, which claims the devices are the world’s smallest class of CMOS image sensors. TAEC says the image sensors offer a high performance image capture capability while remaining low in power consumption.

Dubbed the T4KC3 and T4KC3-121, the image sensors are the first devices to feature TAEC’s proprietary phase-detection auto-focus (PDAF) technology—an auto focus method that moves the focal point in a camera quickly for mobile devices to capture both still and moving objects. Other features of the image sensors include a boost in brightness for enablement of high definition video capture at 240 frames per second and support for high dynamic range (HDR) to capture natural images of scenes with a high contrast ratio.

Andrew Burt, vice president of the Image Sensor Business Unit at TAEC, says in a statement the small form factor of the image sensors and use of Toshiba’s low-power circuit design method allows engineers to “lengthen battery life when the smartphone or tablet is being used in video mode.”

Questions or comments on this story? Contact engineering360editors@ihs.com

Related links:

www.toshiba.com

IHS Semiconductors & Components

News articles:

Advanced Image Co-Processors Target Automotive Cameras

‘Outsiders’ Make Inroads in ADAS Market

Canon Tosses Hat into U.S. Machine Vision Ring

Acquisition Won’t Help OmniVision Corner the Market in China

Dialog Semi, Foxconn, Lite-on to Form Image Sensor JV



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Nov-01 Dec 2017 Helsinki, Finland
23-27 Apr 2018 Oklahoma City, Oklahoma
18-22 Jun 2018 Honolulu, Hawaii
Find Free Electronics Datasheets
Advertisement