Acquired Electronics360

Semiconductor Value Chain

Freescale to Scale IP Portfolio to 16nm FinFET

24 June 2015

Freescale Semiconductor says it will scale its QorIQ multicore processor portfolio down to 16nm FinFET process technology to better target the Internet of Things (IoT).

Freescale (Austin, Texas) claims the next-generation of QorIQ processors deliver twice the performance of its similar 28nm products. The company says it has completed the initial evaluation and testing on 16nm FinFET technology. It is now applying its findings to next-node implementation of cores, hardware accelerators, interconnect fabrics and other intellectual property (IP).

Freescale says it hopes to stay ahead of networks where change is being driven by the convergence of virtualization, software-centric network topologies, the expansion of IoT and the demand for flexible intelligence. Tom Deitrich, senior VP and GM of Freescale’s Digital Networking group, says this change in networks favors semiconductor vendors that have advanced process technology and a “breadth of critical IP like software, advanced acceleration engines and optimized compute densities.”

The company also plans to create semi-custom designs at the 16nm FinFET level for new IP that engineers can use in virtualized networks. Using the QorIQ portfolio, Freescale says its customers can mix and match IP alongside their own IP to differentiate products in the marketplace.

System-on-chips based on 16nm FinFET QorIQ portfolio will begin sampling in mid-2016, the company says.

Questions or comments on this story? Contact engineering360editors@ihs.com

Related links:

www.freescale.com

IHS Semiconductors & Components

News articles:

Cadence Receives Certification for TSMC’s 16nm FinFET Process

Synopsys Snaps Up Atrenta

ARM Offers Optimized IoT Subsystem

Standards Creation a Critical Component of EDA Landscape

Synopsys, Broadcom Expand IP Agreement



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Nov-01 Dec 2017 Helsinki, Finland
23-27 Apr 2018 Oklahoma City, Oklahoma
18-22 Jun 2018 Honolulu, Hawaii
Find Free Electronics Datasheets
Advertisement