Acquired Electronics360

Power Semiconductors

Broadcom Rolls Ethernet Switches

21 April 2015

Fabless chip vendor Broadcom Corp. (Irvine, Calif.) announced the next-generation of its StrataXGS Trident Ethernet switch portfolio, the Trident-II+ Series.

Broadcom Corporation announced the next-generation of its StrataXGS Trident Ethernet switch portfolio, the Trident-II+ Series. Image Source: Broadcom.comBroadcom Corporation announced the next-generation of its StrataXGS Trident Ethernet switch portfolio, the Trident-II+ Series. Image Source: Broadcom.comThe integrated devices offer 1.28 terabit per second (Tbps) switching performance, 30% lower power and double the performance for data center virtualization overlays, such as VXLAN, Broadcom says. They are optimized to meet the bandwidth, scalability and efficiency demands of 10GbE virtualized data centers, according to the company.

Broadcom says more than 60% o servers installed in data centers run on Gigabit Ethernet (1GbE) network connections. The majority of these server ports are expected to transition to 10GbE over the next four years, the company says.

Broadcom’s 28 nanometer Trident-II+ Series provides a drop in power and efficiency improvement with feature and performance upgrades, the company says.

"Our latest Trident-II+ series offers the economics, performance and virtualization capabilities required to lead a similar transition across enterprise data centers worldwide,” says Ram Velaga, senior vice president and general manager of Broadcom’s network switch business, in a statement.

"The collaboration between Broadcom and VMware to define and build robust underlay-overlay technologies allows customers today to deploy fully virtualized networks for greater operational efficiency," says Hatem Naguib, vice president of networking and security at VMware.

Related links and articles:

Shining a Light on a Colourful Market

IHS MEMS & Sensors Page

News articles:



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Nov-01 Dec 2017 Helsinki, Finland
23-27 Apr 2018 Oklahoma City, Oklahoma
18-22 Jun 2018 Honolulu, Hawaii
Find Free Electronics Datasheets
Advertisement