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Electronic Design Automation

Cadence, ARM Ink IP Cross Licensing Agreement

20 March 2015

Cadence Design Systems Inc. and ARM have expanded their partnership with the signing of a multiyear intellectual property (IP) agreement that grants access to each other’s IP portfolios.

Under terms of the deal, Cadence and ARM have the right to manufacture test chips containing Cadence IP and ARM IP as well as provide development platforms to customers. With this ability to test IP interoperability in silicon, both companies can optimize the performance and interoperability of chips for customers playing in the mobile, consumers, networking, storage, automotive and Internet of Things (IoT) space.

The IP agreement includes: existing and future ARM Cortex processors; ARM Mali GPUs; ARM CoreLink system IP; ARM Artisan physical IP; and ARM POP as well as Cadence Design’s PCI Express; MIPI; USB; HDMI; DisplayPort; Ethernet; analog; DDR/LPDDR PHY; and multiple other memory and storage protocol IPs.

Pete Hutton, executive vice president and president of the product groups at ARM, said in a statement that the expansion of the partnership with Cadence "means we are mutually embracing the increasing importance of optimizing the IP systems" in system-on-chip (SoC) designs.

Cadence also announced that it worked with Intel Corp. to deliver a 14 nanometer (nm) library characterization reference flow for Intel's foundry customers. The reference flow is centered on the Cadence Virtuoso Liberate Characterization solution and Spectre Circuit Simulator to enable accurate 14nm logic libraries in designs, Cadence said.

According to Cadence, the reference flow enables Intel Custom Foundry customers to recharacterize the logic libraries for customer process, voltage and temperature corners or to characterize custom cells.

Questions or comments on this story? Contact peter.brown@globalspec.com

Related links:

www.cadence.com

www.arm.com

IHS Semiconductor Manufacturing

IHS Semiconductors & Components

News articles:

To contact the author of this article, email Peter.Brown@ieeeglobalspec.com


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