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MEMS and Sensors

Bosch Rolls Integrated MEMS for Android Smartphones

12 March 2015

Bosch Sensortec has introduced two microelectromechanical systems (MEMS) sensor devices with integrated microcontrollers targeted at Android smartphones.

The BHI160 and BHA250 sensors are designed to buffer sensor data locally on the devices, alleviating the need for the main application processor to be woken up just to process sensor data. This reduces system power consumption, extending the battery life of smartphones, Bosch said.

The sensors integrate a 3- or 6-axis MEMS sensor with Bosch's digital signal processor (DSP) Fuser core microprocessor. The sensors are fully compatible with the Android Lollipop sensor stack and can be updated with new software features to support future Android releases.

The MEMS devices are scheduled for sampling in the second quarter of this year.

Questions or comments on this story? Contact peter.brown@globalspec.com

Related links:

www.bosch-sensortec.com

IHS MEMS & Sensors

News articles:

To contact the author of this article, email Peter.Brown@ieeeglobalspec.com


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