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Broadcom Inks Deals with SK Telecom, KT

02 March 2015

It's been a busy few days for Broadcom Corp. , which released a new system-on-chip (SoC) product for virtual customer premise equipment and trumpeted two design wins for telecommunications in South Korea.

The two deals with South Korean telecom companies are for similar wireless products under Broadcom's umbrella. First, Broadcom said it is supplying small cell SoC devices to KT Corp., a telecom and Internet vendor in South Korea formerly known as Korea Telecom, to enhance KT's 4G LTE wireless broadband services. KT will use the Broadcom 617xx chipset in order to address its increasing capacity demands while optimizing spectral efficiency.

The second deal also involves Broadcom's small cell SoC devices supplying the chips to SK Telecom, South Korea's largest telecommunications vendor, to enhance its own line of high-speed 4G LTE services. SK will use the BCM61765 SoCs to not only increase the overall throughput of its network but also to extend network coverage and capacity. SK will be able to increase its bandwidth and data throughout by aggregating two non-contagious bands in its LTE equipment.

Meanwhile, Broadcom launched a new SoC designed to work in the virtual customer premise equipment (vCPE) market. The SoC allows operators to decouple services from physical hardware and run them on a standard compute infrastructure enabling a faster time-to-market and customization.

The Broadcom BCM88312 is an integrated and programmable device that connects to the operator's network to deliver vCPE services "without the need for manual provisioning and expensive truck rolls," said Ed Redmond, Broadcom vice president of Broadcom's Compute and Connectivity group, in a statement.

Broadcom said it will showcase its small cell SoCs during the Mobile World Congress this week (March 2-5) in Barcelona.

Questions or comments on this story? Contact peter.brown@globalspec.com

Related links:

www.broadcom.com

IHS Semiconductors & Components

News articles:

To contact the author of this article, email Peter.Brown@ieeeglobalspec.com


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