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Qualcomm Heats Up Chipset Competition

25 February 2015

On Feb. 18, Qualcomm announced a re-branding of its thin-modem product line, incorporating those products under the Snapdragon umbrella, a marked shift away from the former Gobi branding. The company has also announced 4 new processors to address various price points in between the premium and entry-level product tiers. The Snapdragon 620 and 618 are the two additions to the 600 tier while the 425 and 415 are new to the 400 product tier. Three of the four SoCs will have an integrated Cat 7 LTE modem capable of 300 Mbps DL and 100 Mbps UL.

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Questions or comments on this story? Contact peter.brown@globalspec.com

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