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Spansion Introduces First HyperRAM Product

23 February 2015

Spansion Inc. has rolled out its first RAM device that works with the embedded memory vendor’s HyberBus interface technology.

As a companion to Spansion’s already announced HyperFlash memory, HyperRAM will provide a simplified and cost-effective option for system on chips (SoCs) and microcontrollers, where both the flash and RAM are connected on the same 12-pin HyperBus interface, Spansion said. The HyperRAM memory operates at frequencies as fast as 166MHz in DDR mode with a fast, random initial access time of 36ns, the company said.

Spansion said the combination of the HyperRAM and HyperFlash will allow for easier board designs and software development for a faster time to market. Spansion is targeting the memory for the Internet of Things (IoT), factory automation, medical equipment, home automation, ADAS, digital cameras and automotive infotainment.

Jackson Huang, VP of product marketing and ecosystem at Spansion, said in a statement the company’s HyperRAM memory is “ideal for SoCs with limited RAM” and is a “natural step in the evolution of the HyperBus interface.” Huang added the memory minimizes the number of pins normally required to support standard DRAM “resulting in reduced PCB complexity and cost.”

The Spansion HyperBus interface is designed to reduce the overall cost of systems in a wide range of applications including automotive instrument clusters, digital cameras, projectors, factory automation, medical diagnostic equipment and home automation and appliances. Freescale has already introduced an automotive MCU that supports the HyperBus interface and Spansion said it is currently working with other processor companies and support for more system on chips (SoCs) and MCUs.

The 64Mb HyperRAM is slated to begin sampling in the second quarter of 2015 in both a 3V and 1.8V versions.

Questions or comments on this story? Contact peter.brown@globalspec.com

Related links:

www.spansion.com

IHS Memory

News articles:

Spansion Enters Automotive ADAS Power IC Market

Spansion Teams with Chinese Foundry on 3D NAND

Spansion Settles Patent Dispute with Macronix

Spansion, Sensoplex Team on Wearables Dev Kit

Cypress, Spansion Agree to $4 Billion Merger

To contact the author of this article, email Peter.Brown@ieeeglobalspec.com


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