The companies have entered into a long-term partnership for both commercial and research endeavors including future initiatives for virtualized networks. Specifically, the companies will collaborate on what they claim is the first universal access device that can be used for any combination of wireline and wireless connections.
Tom Deitrich, senior VP and GM of Freescale’s Digital Networking Group, said in a statement that as the Internet of Tomorrow grows the number of network endpoints “boosting throughput and enhancing quality of service become even more important.” Deitrich added this is where the partnership will focus moving forward.
The partnership will pair Freescale’s knowledge of networking silicon and software with Bell Labs’ knowledge of converged solutions with the expected result to be configurable access technology that supports both wireline and 5G wireless processing in a single architecture, the companies said. The technology will allow for a simplified and faster deployment of next-generation networks for service providers that will reduce capital expenditures.
The first proof of concept of the new technology is expected to be unveiled in the first quarter of 2017.
In other Freescale news, the Austin, Texas-based company has introduced a RF power transistors housed in high-power plastic packaging.
The plastic packaging is compatible with mass volume soldering processes and enables a tighter dimensional tolerance that will allow for a 30 percent reduction in thermal resistance compared to ceramic-packaged transistors, Freescale said.
With the introduction of these parts, Freescale’s industrial RF power transistor portfolio includes five ceramic and give plastic packaged devices. One device, the MRFE6VP61K25N is available in production now and another is sampling with production slated for April.
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