Acquired Electronics360

Semiconductors and Components

Spansion Enters Automotive ADAS Power IC Market

19 February 2015

Spansion Inc. has introduced its first automotive-grade power management chip for advanced drive assistance systems (ADAS).

Part of a new family of ADAS products, Spansion said the ADAS power management IC is a multi-rail device with solid control pins for each rail and includes voltage integrity monitors as well as a windowed watchdog timer to lower the system heat, complexity and cost for implementation of ADAS in vehicles. The chip, labeled as S6BP401A, also supports automotive safety integrity level-B.

IHS Technology forecasts revenue for ADAS chips to reach $2.6 billion by 2020, growing more than fourfold from revenue levels in 2010.

Kiyoe Nagaya, VP of analog marketing at Spansion, said in a statement that the company has been providing flash memory and MCU products for ADAS and this chip “expands our portfolio in automotive power supply products into the system level.” Nagaya added the chip was designed along with one of Spansion’s key automotive customers.

The single-chip ADAS power management device includes a 6-channel power output (a 4-channel DC/DC converter and a 2-channel LDO) that helps to reduce the printed circuit board (PCB) size and bill of materials resulting in a smaller, cost-effective ADAS, Spansion said.

The ADAS power management IC is available now for sampling.

Spansion has been busy lately tiding up its lawsuits, getting more involved in thewearables market, expanding its presence in the industrial market and IoT as well as becoming part of a larger whole after getting acquired by Cypress.

Questions or comments on this story? Contact peter.brown@globalspec.com

Related links:

www.spansion.com

IHS Automotive & Transportation

News articles:

Spansion Teams with Chinese Foundry on 3D NAND

Spansion Settles Patent Dispute with Macronix

Spansion, Sensoplex Team on Wearables Dev Kit

Cypress, Spansion Agree to $4 Billion Merger

Spansion Rolls Industrial-Grade NAND

To contact the author of this article, email Peter.Brown@ieeeglobalspec.com


Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Nov-01 Dec 2017 Helsinki, Finland
23-27 Apr 2018 Oklahoma City, Oklahoma
18-22 Jun 2018 Honolulu, Hawaii
Find Free Electronics Datasheets
Advertisement