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Memory and Storage

Spansion Teams with Chinese Foundry on 3D NAND

06 February 2015

Spansion Inc. has entered into an agreement with Chinese semiconductor foundry XMC to jointly develop 3D NAND technology to be used in the fast growing Internet of Things (IoT) market and automotive systems.

Spansion said 3D NAND will help contribute to the increasing needs of memory requirements and low form factors of emerging applications. XMC will manufacture the devices in its 300mm facility.

Ali Pourkeramati, senior VP of strategic alliances at Spansion, said in a statementthat new applications for IoT and advanced automotive systems is placing “greater demands on storage technologies.” He added that 3D NAND will “revolutionize how data will be more efficiently stored in the future.”

Spansion’s charge trap MirrorBit technology will be one of the key features in the 3D NAND flash technology enabling high performance data storage, Spansion said.

The first of the 3D NAND products is slated to be available in 2017.

Spansion has been busy lately tiding up its lawsuits, getting more involved in thewearables market, expanding its presence in the industrial market and IoT as well as becoming part of a larger whole after getting acquired by Cypress.

Questions or comments on this story? Contact dylan.mcgrath@ihs.com

Related links:

www.xmcwh.com

www.spansion.com

IHS Memory

News articles:

Spansion Settles Patent Dispute with Macronix

Spansion, Sensoplex Team on Wearables Dev Kit

Cypress, Spansion Agree to $4 Billion Merger

Spansion Rolls Industrial-Grade NAND

Spansion Targets Industrial IoT with MCU Expansion

To contact the author of this article, email Peter.Brown@ieeeglobalspec.com


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