Midwest system-on-chip vendor Tezzaron Semiconductor has signed an agreement with Rambus Inc. to incorporate the memory intellectual property (IP) cores supplier’s oxide-resistive memory (ReRAM) technology into its future semiconductors.
The architecture license gives Tezzaron access to system IP, specifications and validation suits to design chips using the ReRAM IP cores, which Tezzaron said it will use to build storage-class 3D memory devices for military, aerospace and commercial applications, Rambus said. Tezzaron also plans to port the ReRAM into other ICs including SoCs, field programmable gate arrays (FPGAs) and processors for use in the company fabrication subsidiary, Novati Technologies. Using the ReRAM, Tezzaron said its Novati subsidiary can add hundreds of megabytes of storage to a logic device manufacturing in a standard fab.
Gary Bronner, VP of Rambus Labs, said in a statement that ReRAM fills the gap between what DRAM and flash can provide while “being highly reliable and high speed.” He added the collaboration with Tezzaron will allow for differentiated memory architectures “for numerous use cases across the embedded landscape.”
Tezzaron said that the first family of ReRAM-based devices are currently in design and scheduled for production in 2016.
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