Acquired Electronics360

Distribution

Molex Acquires Canadian Wireless Components Firm

07 January 2015

Interconnect and cable assembly provider Molex Inc. has acquired SDP Telecom, a Canadian company that designs and manufactures RF/microwave products for the wireless communications industry.

“Together, Molex and SDP will broaden our RF/microwave product capabilities and create additional value for our customers in the growing wireless infrastructure market, said Tim Ruff, senior vice president for Molex, in ?a statement.

Founded in 1995, SDP, designs and builds complex surface mount passive microwave structures, and sophisticated sub-assemblies. Its product portfolio includes ferrite Isolators/circulators, surface mount strip-line couplers, filters, combiners, diplexers, tower mount amplifiers (TMA), orthomode transducers (OMT) and other waveguide products among others.

In addition to its Montreal, headquarters, SDP has manufacturing facilities in China. SDP will be managed by the RF/Microwave Business Unit that is part of Molex’s Global Integrated Products Division.

?Molex, based in Lisle, Ill., said the acquisition will help drive its sales in the wireless market. “This is a next step towards achieving our vision to offer total integrated solutions to the markets we serve,” said Ruff.

Because of the increased use of smart devices globally and an increase in the amount of data carried over wireless infrastructure, wireless carriers are investing in upgrading infrastructure to ensure quality service, Molex said. SDP solutions are used by top-tier wireless infrastructure equipment makers to improve signal transmission efficiency over wireless networks.

“The acquisition provides a unique value proposition for deeper technical engagement with wireless equipment makers, said SDP Telecom founder and COO Shyam Gupta. He added Molex and SDP have many growth opportunities in multiple segments of the wireless market.

Terms of the acquisition were not disclosed.

Questions or comments on this story? Contact dylan.mcgrath@ihs.com

Related links:



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Nov-01 Dec 2017 Helsinki, Finland
23-27 Apr 2018 Oklahoma City, Oklahoma
18-22 Jun 2018 Honolulu, Hawaii
Find Free Electronics Datasheets
Advertisement