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Semiconductors and Components

SiBEAM Aims to Replace all Connectors in Wireless Devices

06 January 2015

Just one day after Silicon Image re-launched its SiBEAM subsidiary, the division has rolled out its first product, a wireless connector technology to help enable thinner mobile devices.

Dubbed Snap, the wireless connector technology is designed to improve the robustness of physical connectors in order to prevent mishaps such as water damage or drops. The Snap technology would replace physical connectors on a wide variety of devices such as smartphones, tablets, 2-in-1 laptops, action cameras, wireless docks and point-of-sale (POS) kiosks.

Replacing the physical connectors with the SiBEAM Snap technology allows device makers to manufacture devices that are completely wireless, thinner, lighter and better protected from damage caused by water, mud and dust, SiBEAM said. When combined with wireless charging, SiBEAM Snap technology can completely replace the USB, HDMI or DisplayPort connectors for data and video transfers as well as the power charging feature making it a completely connector-free mobile device, the company said.

David Kuo, senior director of marketing at SiBEAM Inc., said in a statement the Snap technology frees designers “from all mechanical constraints of connectors” which will lead to the development of “more functional and elegant mobile devices.”

The first two Snap single-chip ICs have been introduced – the SB6212 transmitter and the SB6213 Snap receiver – that are designed to replace any USB 2.0 or USB 3.0 connector, SiBEAM said. The chips deliver up to 12Gb/s of bi-directional throughput wirelessly for high-speed video and data transfer, the company said.

Silicon Image relaunched its SiBEAM subsidiary in order to focus on accelerating the use of millimeter-wave products for current and future generations of wireless semiconductor products and intellectual property.

Related links:

www.sibeaminc.com

IHS Connectivity & IoT

News articles:

Silicon Image Re-launches Subsidiary

Spansion, Sensoplex Team on Wearables Dev Kit

Freescale Steps Wireless Charging Up to 15W

Qualcomm Backs Silicon Image IoT Spinoff

Broadcom Adds Chips, NFC to its IoT Platform



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