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Semiconductors and Components

Spansion, Sensoplex Team on Wearables Dev Kit

19 December 2014

Chip vendor Spansion Inc. and wearable electronics vendor Sensoplex announced this week they would jointly develop and market an evaluation and development kit platform for wearable electronics devices.

According to the companies, the platform will help customers develop wearable devices combining inertial, bio and environmental sensors along with low-power wireless protocols Bluetooth Low Energy and ANT+.

"Our partnership with Sensoplex provides key hardware and [software development kit] building blocks that enable customers to deploy a wide range of wearable products while greatly reducing complex system-level design and time to market,” said Dhiraj Handa, senior vice president and general manager of Spansion's multi-market microcontroller business, in a statement.

The companies say the jointly developed platform for wearable devices offers high performance and can reduce time to market. The platform includes Spansion FM3 microcontrollers, 256Mb of FL-S serial flash memory, Sesoplex’s PDI air interface for wireless data communications over BLE or ANT+ and Sensoplex APIs for firmware development, as well as sample apps for Android and iOS and additional Sensoplex design and manufacturing services, the companies said. The platform has FCC and CE certification, the companies said.

Related links:

IHS Technology Industrial, Security & Medical Page

Fujitsu Targets Industrial Market with FRAM Chip

Cypress, Spansion Agree to $4 Billion Merger

Atmel Launches Digital Temperature Sensor Family

Industrial Chip Market on Pace for 13% Growth

Spansion Rolls Industrial-Grade NAND



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