Acquired Electronics360

Semiconductors and Components

Murata Completes Acquisition of Peregrine Semi

12 December 2014

Murata Electronics has finalized its acquisition of Peregrine Semiconductor Corp. in an all-cash transaction at $12.50 per share of Peregrine common stock.

In August, Murata announced it was acquiring the radio frequency (RF) silicon on insulator (SOI) chipmaker in a deal worth $471 million. At the time, Murata said it would add Peregrine’s portfolio to its own RF module business after working closely with the company for many years.

Norio Nakajima, executive VP and director of the Communication Business Unit at Murata, welcomed Peregrine to the company in a statement saying the acquisition would “deepen our existing partnership” with Peregrine and combine Murata’s RF modules with Peregrine’s own RF products. Nakajima added that Murata plans to expand its business “into all the markets that Peregrine currently offers RF solutions” and the company is “eager to leverage Peregrine’s innovations.”

Peregrine will continue to offer its RF products under its own brand as a wholly owned subsidiary of Murata in the realm of the communications, industrial and aerospace markets. The combined company will now contain more than 180 filed and pending patents, Murata said.

Jim Cable, president and CEO of Peregrine, said in the same statement that the combined company will “change the course of RF history” and specifically in the mobile market will speed up the transition to “an integrated, all-CMOS RF front-end.”

Related links:

www.murata.com

www.psemi.com

IHS Semiconductors & Components

News articles:

Murata to Spend $471 Million on Peregrine Semi

Peregrine, RF Micro Settle Lawsuit, Strike Patent Deal

Peregrine and LG Team Up on Antenna Tuning Design for LG Optimus G Pro

Freescale Acquires Zenverge to Advance IoT Security

MagnaChip Offering 0.18 Micro SOI RF CMOS Process Technology



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Nov-01 Dec 2017 Helsinki, Finland
23-27 Apr 2018 Oklahoma City, Oklahoma
18-22 Jun 2018 Honolulu, Hawaii
Find Free Electronics Datasheets
Advertisement