Acquired Electronics360

Power Semiconductors

Cree Rolls all-SiC Power Module

29 September 2014

Cree Inc. has introduced what it calls the industry’s first all silicon carbide (SiC) 1.7kV power module targeted at replacing silicon-based insulated-gate bipolar transistor (IGBT) modules in industrial applications.

The half-bridge module, powered by Cree’s C2M large area SiC chip technology, has an on-resistance of 8 milliohms and 10 times higher switching efficiency than standard silicon based components. Cree said the device allows engineers to reduce the size and cost of magnetic and cooling elements in a design while improving system efficiency and reliability, something that can't be done using an IGBT.

Figure 1

Cree’s 1.7kV power module

Cree said the power module will lower production costs and the development of smaller, lighter products with lower overall total cost of ownership in such applications as motor drive, grid-tie and utility scale solar inverter applications. Cree said the power module allows for a simplified system design and low-mean time to repair for high overall system availability.

Devin Dilley, director of medium voltage R&D at Vacon, a supplier of AC drives, said in a statement the Cree power module in motor drives “will enable a reduction in the side and cost of filter components by up to 40 percent while simultaneously increasing system efficiency.”

The half-bridge module is available from distributors Mouse, Digi-Key and Richardson RFPD/Arrow RF & Power.

Related links:

www.cree.com

IHS Semiconductors & Components

News articles:

ON Semi Partners to Deliver GaN-based Power Chips

Dialog Semi Expands Power Adapter Portfolio

Vishay Unveils Low Voltage MOSFET Family

Digi-Key Signs Inventek; Mouser Expands Switch Sensor Line

Precision Analog ICs Accomplish What Software Won't Ever Achieve



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Nov-01 Dec 2017 Helsinki, Finland
23-27 Apr 2018 Oklahoma City, Oklahoma
18-22 Jun 2018 Honolulu, Hawaii
Find Free Electronics Datasheets
Advertisement