Acquired Electronics360

Semiconductors and Components

Toshiba to Expand Discrete Business

29 August 2014

Toshiba Corp. is expanding its portfolio of discrete semiconductors in response to what the Tokyo-based company sees as a changing business environment with the advent of smartphones, tablets, smart cars and renewable energy sources.

Toshiba said it is looking to expand its small-signal device and Opto device product lines by providing productivity improvements to its Toshiba Semiconductor Co. Ltd. Thailand-based subsidiary, expanding its high value-added product line, specifically in the industrial market, and by enabling its discrete business to be more flexible to react to market changes.

Meanwhile, in order to meet the demand for the industrial market in China, which Toshiba said is slated for strong market expansion, as well as to meet the need of a strong market in Japanese automobiles, the company will be adding capacity to its 200mm line in Kaga Toshiba Electronics for MOSFETs. These discretes are a key focus area for Toshiba where the company said it has already won orders on next-generation automotive products.

Toshiba also said it plans to invest in next-generation materials for discrete devices including silicon carbide (SiC) for high voltage and high frequency field and gallium nitride (GaN) power devices for super high frequency and applied GaN on Si technology for white light emitting diodes (LEDs). Toshiba said it will collaborate with its in-house system companies to bring these devices to fruition leading to market expansion.

Related links:

www.toshiba.co.jp/index.htm

News articles:

Toshiba Claims Billion-Dollar Damages From SK Hynix

Toshiba, SanDisk Aim 3D-NAND Fab at 2016 Production

Google Selects Rockchip for Modular Smartphone Processor

AMD Enters SSD Market Targeting Gamers

ASML Touts EUV Lithography Progress



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Nov-01 Dec 2017 Helsinki, Finland
23-27 Apr 2018 Oklahoma City, Oklahoma
18-22 Jun 2018 Honolulu, Hawaii
Find Free Electronics Datasheets
Advertisement