The Samsung BlackJack is a mid to high-end PDA phone supporting 3.5G (HSDPA) dual-band UMTS & quad-band GSM EDGE. It comes with Windows Mobile 5.0, a 2.3 240x320 Pixel 262K color TFT display, a 1.3MP CMOS camera, a full QWERTY keyboard & a MicroSD memory card expansion slot. Other highlights include Bluetooth V2.0+EDR & real-time email delivery (as a wink and a nudge to RIM).
The Samsung BlackJack SGH-i607 is a Cingular Version of SGH-i600. The most distinct difference is that the SGH-i600 has 802.11b/g while this BlackJack does not. Otherwise, the BlackJack is a sleek, ultra-thin PDA smart phone with plenty of features.
The Samsung BlackJack appeals to audiences who want 3G and 3.5G data service while also want to have a long list of features. Looking at Cingular's web site, there is virtually no other PDA or smart phone can come close to compete in terms of price and features.
Mid November, 2006, per Cingular's press release.
Pricing and Availability
Available now for $199 after rebate with a 2 year contract from Cingular.
HSDPA phones, especially HSDPA enabled ones, are relatively new on the market and have not seen a great deal of penetration yet worldwide, we are therefore assuming a relatively low lifetime production volume of approximately 2.1M units for this model. This estimate based on the assumption of 2 year life span maximum.
Our volume production assumptions are meant primarily to be used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially).
ISuppli's Design Forecast Tool (DFT) and This Device
As part of iSuppli's Design Forecast Tool (DFT), we forecast handset shipments by major design feature and manufacture, as well as the number of design starts a manufacturer will have by feature set. From our most recent revision of this tool iSuppli estimates 11M HSDPA handsets will ship in 2007 in the global market, and that total unit shipments of Windows-based mobile phone will be approximately 16 million.
We further forecast the introduction of 58 HSDPA handsets by Samsung in 2007 (increasing to 106 models in 2008); and iSuppli forecasts 18% of the HSDPA market share for Samsung.
Function / Performance
Functional testing was not performed on the Samsung BlackJack SGH-i607
Phone costs are largely feature driven, but also driven by general manufacturing complexity, design for manufacturing (or DFM), component counts and of course the country where they are assembled. This phone is a simple candy bar QWERTY phone which mechanically is not complex, however, the phone is driven in cost by the features it has - such as the display, HSDPA capable chipset, the extra OMAP applications processor and the extra MCP memory.
Main Cost Drivers Representing approximately 69% of the total BOM material costs
Qualcomm - MSM6275 - Baseband Processor - Single Chip, Quad-Band GSM/GPRS, GPS, UMTS, HSDPA & Bluetooth
Samsung - LTS230QV-F06 - Display Module Value Line Item - 2.3' Diagonal, 262K Color TFT, 240 x 320 Pixels
Samsung - KBE00F005A-D411 - MCP - 1Gb (2 Die x 512Mb) 2.7V NAND Flash, 512Mb (2 Die x 256Mb) 1.8V Mobile SDRAM
Samsung - AB653450CA - Battery - Li-Ion, 3.7V, 1250mAh (x2 - $4.58 each)
Camera Module - 1.3MP, CMOS, 1/4' Format - Fixed Lens
Texas instruments - OMAP1710 - Applications Processor - ARM926 Core, 220MHz, 90nm
Samsung - K5W1G12ACA-DK75 - NPI* - MCP - 1Gb NAND / 256Mb Mobile SDRAM (Content assumed)
Samsung Electro-Mechanics - Main PCB - 10-Layer - FR4/RCF HDI, 2+6+2, Lead-Free
Samsung - BTTM46C2SA - Bluetooth Module - V2.0+EDR, Contains CSR BlueCore Chip
PCB - 3-Layer - Flex Kapton, w/ESD/EMI Coating
Qualcomm - RTR6250 - RF Transceiver - ZIF, Quad-Band GSM/GPRS Transceiver and Tri-Band UMTS 800/1900/2100MHz Transmitter
Qualcomm - PM6650 - Power Management IC
Qualcomm - RFR6202 - RF Receiver - ZIF, Dual Band UMTS 800/2100MHz
Samsung - ATADM10JBE - Charger - 5V, 700mA
Keypad Assembly - Injection Molded Plastic Keys on Flex Substrate, Painted, Silkscreened
Materials and Manufacturing*
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing and test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
Country of Origin
Samsung makes all their mobile phones in house. About 70% of their products are made in Korea and 30% are made in lower cost countries such as China and India. In this case, the BlackJack is labeled as Made in Korea, but that custom mechanicals (plastics and metals) were sourced from China. Chargers and other box contents are mostly made in China except for the charging station. In addition, the PCBA were assumed to be populated also in Korea.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as chargers), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Design for Manufacturing / Device Complexity
At an overall component count of 937, the Samsung BlackJack seems to have a high component count when compared with other PDA phones we have analyzed. However, the BlackJack is HSDPA enabled PDA phone. With about 40 more components compared to the Motorola Q (total component count of 893 - both have the same form factor) without HSDPA, the BlackJack still falls within the norm in terms of total component count. From the mechanical point of view, the BlackJack is ""heavy" with a mechanical components count of 138. For its candy bar form factor, it certainly can integrate better as we see in Blackberry 8700c with only 61 mechanical components. More mechanically complex phones generally involve more hand assembly, and have longer manufacturing cycle times.
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, increased in this case because of assumed labor rate applied for Korea vis--vis much lower rates applied when the country of origin is China.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
The overall design of this phone is basically a typical Qualcomm-based Samsung HSDPA phone plus an extra applications processor to handle the software needs. In fact the baseband and RF section of this phone is identical to previously seen SGH-ZX20 & SGH-Z520 which incorporate Qualcomm MSM6275 single-chip baseband with RTR6250, RFR6202 & RFL6202.
In the PAM section, it features a quad-band GSM EDGE power amplifier by TriQuint Semiconductor which again is seen in the SGH-ZX20. For the 2 WCDMA frequency band supported, the BlackJack has 2 PAMs from Avargo Technology which is usually not a player in Samsung phones' PAM section. In most of the Samsung phones we have seen, the WCDMA PAMs are largely supplied by Anadigics instead.
To support the Windows Mobile 5.0 and other applications, a TI OMAP1710 220MHz processor is added to the BOM. The dual-core processor complements the MSM6275 and is mainly responsible for running all software including Windows itself.
Here is a summary of the major components used in the Samsung BlackJack design:
- Baseband - Qualcomm - MSM6275 - Single Chip, Quad-Band GSM/GPRS, GPS, UMTS, HSDPA & Bluetooth
- Application Processor - Texas instruments - OMAP1710 - ARM926 Core, 220MHz, 90nm
Battery / Power Management
- Power Management IC - Qualcomm - PM6650
- Samsung - KBE00F005A-D411 - MCP - 1Gb (2 Die x 512Mb) 2.7V SLC NAND Flash, 512Mb (2 Die x 256Mb) 1.8V Mobile SDRAM
- Samsung - K5W1G12ACA-DK75 - MCP - 1Gb SLC NAND Flash, 256Mb Mobile SDRAM
- PAM (GSM) - TriQuint Semiconductor - TQM7M5003 - Quad-Band, GSM/GPRS/EDGE
- PAM (WCDMA1900) - Avago - WS2411 - PAM - UMTS1900
- PAM (WCDMA850) - Avago - WS2111 - PAM - UMTS850
- RF Transceiver (GSM/UMTS) - Qualcomm - RTR6250 - ZIF, Quad-Band GSM/GPRS Transceiver and Tri-Band UMTS 800/1900/2100MHz Transmitter
- RF Receiver - Qualcomm - RFR6202 - Dual Band UMTS 800/2100MHz
- LNA - Qualcomm - RFL6202 - Dual, UMTS 800/2100MHz
Antenna Switch - Sony - CXG1198AEQ - GSM/UMTS Dual Mode
- Samsung - BTTM46C2SA - Bluetooth Module - V2.0+EDR, Contains CSR BlueCore Chip
- 2.3' Diagonal, 262K Color TFT, 240 x 320 Pixels
- Camera Module - Manufacturer / PN# Unknown
- Image Sensor
- Manufacturer Unknown - 1.3MP, CMOS, 1/4' Format - 3.2um x 3.2um Pixel Size, 4.10mm x 3.30mm Active Image Area
- No Flash