When we tear down automotive modules - their exact function(s) as well as what vehicle(s) they come from are often difficult to ascertain, and for this module, it is still the case - we don't know much about the device as a functioning unit, other than it is built for Cummins by Continental. The Continental relationship is confirmed by PCB markings. The design appears to go back to 2004. We found references to the CM2150 (engine, of which this is a subsystem) to be referenced by Blue Bird (school bus manufacturers). However, it's assumed this is also used in other truck designs.
Unlike the previous Cummins module analyzed, where many of the parts were designed in the 1990's and many parts were obsolete, this design features primarily ICs labeled from the 2000's. The CM2150 board is marked 2004 - so that should be the vintage of design. Obsolescence did not appear to be an overriding issue or major factor as we researched the parts, however, this BOM analysis is worthy of analyzing using our other IHS tools for a more complete view as many of the components in the BOM are likely mature with estimated ends of life approaching. The core devices in this analysis are Freescale and Atmel MCUs, and an Infineon power mgmt. IC.
Modules such as this are designed specifically to control a specific engine(s) - and as a result is really just captive market product designed to accompany OEM equipment and to be offered as spares for maintenance of engines.
Based on PCB markings this model appears to be 2004 vintage.
Pricing and Availability
Pricing not collected for this system - not a 'retail' product per se - would be sold through equipment and engine service centers.
Availability - Assumed to be available in world markets where Cummins engines and products are sold.
100,000 Annual Production Units
5 Total Years
For the purposes of this teardown analysis, we have assumed an Annual Production Volume of 100000 units and a Product Lifetime Volume of 5 year(s).
Teardown volume and production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
Our cost analysis is meant to be as calibrated as possible to the production volumes being used, but also particular to the level of pricing that we would expect a company like Continental to be able to achieve in the market. 'Automotive' grade component pricing is applied when the found specs match such requirements.
Total BOM: $113.78
Top Cost Drivers below: $67.67
% of Total BOM 59%
Main Cost Drivers below
Freescale Semiconductor MPC5566MZP80 MCU - 32-Bit, 80MHz, 3MB Flash, 128kB RAM, Automotive- (Qty: 1)
2-Layer - FR4, Lead Free- (Qty: 1)
Ceramic Multilayer - X5R/X7R- (Qty: 438)
Delphi Pin Header - 6-Row, Shrouded, Automotive, w/ 2 Plastic Snap-In Pins & Rubber Gasket- (Qty: 2)
PCB Mounting Plate - Stamped / Formed Aluminum- (Qty: 1)
ST Microelectronics STB75NF75L MOSFET - N-Channel, 75V, 75A- (Qty: 6)
Atmel AT56712-2 MCU- (Qty: 1)
Cypress Semiconductor CY62137VNLL-70ZSXE SRAM - 2Mb, Automotive- (Qty: 1)
Infineon TLE6368G1 Power Supply IC - Multi-Voltage, for Processor, Automotive- (Qty: 1)
ST Microelectronics VNB14NV04 MOSFET - N-Channel, 40V, 12A, Fully Protected- (Qty: 2)
Not Included in Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
We do provide an Excel tab 'Overall Costs' where a user can enter their known pre and post production costs to build a per unit cost reflective of theirs actual expenditures.
This device was built for Cummins by Continental - a very well-known electronics producer in the automotive space and a global footprint.
Country of Origin
For the purposes of this analysis, we are assuming the following country(ies) of origin for each level of assembly, based on a combination of 'Made In' markings, and/or assumptions based on our knowledge of such equipment.
Main PCB - United States
Other - Enclosures / Final Assembly - United States
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies sold as a unit, we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Component counts by assembly and the number of assembly are indicators of design complexity and efficiency.
Component Qty: 1594 - Main PCB
Component Qty: 9 - Other - Enclosures / Final Assembly
Component Qty: 1603 - Grand Total
What makes this design unusual from a 'normal' electronics point of view is the fact that this design is spread out over two single sided PCBs which are both very thin PCBs mounted to an aluminum plate which acts as both a mounting plate, and a broad heat sink for the electronics. The drawback of doing this, is two fold 1) It adds complexity and cost (the PCBs must be bonded to the plate, and the two boards are interconnected by some very broad and pricey flex circuits), and 2) It forces the designers to spread out the electronics over larger PCBs because only one side can be used for the component mounting. It makes the overall design envelope very large as well.
Otherwise - as with most automotive design - at the end of the day the total number of assemblies is limited and simple -- and almost all of the components in the system are mounted on the PCBs using factory automated lines (pick and place assembly). 'Hand assembly' is just final integration of the two boards on to the mounting plate - simple. As a point of reference a typical smartphone contains about 1000 components.
At the core of this system are two MCUs - one from Freescale (MPF5566MPZ80) and from Atmel (AT56712-2 - AT56712-2 - labeled 'Diesel' so likely a custom part for Cummins - or at least an ASIC).
The rest of the design is primarily lower level discrete power electronic components (ST and Vishay MOSFETs) which are driven by an Infineon power management IC (TLE6368G1).
The design is also supported by a modest amount of SRAM - 2Mb of automotive grade SRAM from Cypress Semiconductor.