Main Features / Overview
The LG KS20 bears a great deal of physical similarity to the LG Prada phone - it has the same basic presentation and features a prominent 2.8 diagonal TFT w/ touchscreen (the touchscreen used here is a conventional 4-wire resistive - nothing like the iPhone). However, the KS20 is far more powerful than the Prada, and features 7.2Mbps HSDPA downlink capability (the first time we have seen that), and HSUPA (also a first, which allows users uplink speeds of 5.76Mbps). This key data speed feature is provided by another first time sighting - the Qualcomm MSM7200 chipset.
Other than that - the KS20 is a tri-band GSM and single band (2100MHz) UMTS PDA device with dual cameras (the primary featuring auto-focus (rare still) 2MP, with a VGA secondary module, Bluetooth 2.0, and FM Radio. The KS20 runs Mobile Windows 6, and expandable memory via a MicroSD slot.
WiFi - despite having been mentioned in numerous online articles does NOT appear to be a feature offered by this device as no chips were present in the design to support this purported functionality.
Despite the very high data rate speed that leaves the iPhone in the dust - the use of a conventional touchscreen, and the lack of Wifi, and for that matter, anything running a Windows platform makes this device high suspect as an 'iPhone killer'. It is very doubtful that droves will adopt this phone in lieu of iPhones despite the data rate, as usability and interface are still the key iPhone features.
Early tech adopters / high-end consumers - this particular model appears to have been made for the Euro market (based on single 2100MHz UMTS band). The buzz on the internet is that this device and others like it are part of a cadre of 'iPhone Killers' - that is unlikely to be the future of the KS20.
Not released yet at the time of analysis. Unit analyzed appears to have been prototype and featured no internal labels.
Unknown at the time of writing as unit was unreleased.
For the purposes of this teardown, we estimate unit shipments for the LG KS20 over the course of a 2-year production lifetime would be on an order of magnitude around 1.3 million units.
As a reminder, volume production assumptions are not meant to be necessarily 'market accurate', but are meant primarily to be used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially).
ISuppli's Design Forecast Tool (DFT) and Market Shares
As part of iSuppli's Design Forecast Tool (DFT), we forecast handset shipments by major design feature and manufacture, as well as the number of design starts a manufacturer will have by feature set.
From our Design Forecast Tool (DFT), we estimate a total of 32 Million units shipped in HSDPA in the 2007 global market, and further estimate unit shipments of 8 million 2 megapixel camera phones in the 2007 global market by just LG. Keep in mind, however, that this unit represents only one portion of the HSDPA market (7.2Mbps), vs. the older 1.8Mbps and 3.6Mbps devices still in production. 7.2Mbps HSDPA with HSUPA represents the cutting edge in data transmission speeds over wireless phone networks.
Function / Performance
No testing was performed on this unit.
Main Cost Drivers Representing ~75% of total materials cost as follows :
Qualcomm HSDPA 7.2 / HSUPA 5.76 MSM7200 Chipset
MSM7200 Baseband Processor - Single Chip, Quad-Band GSM/GPRS/EDGE, HSDPA 7.2Mbps, HSUPA 5.76Mbps, Integrated 400MHz ARM11 Applications Processor & 274MHz ARM9 uProcessor
RTR6275 - RF Transceiver - ZIF, Quad-Band GSM/GPRS/EDGE Transceiver and Tri-Band WCDMA 850/1900/2100MHz Transmitter and Single-Band UMTS 1900 or 2100 Receiver
PM7500 - Power Management IC
Primary Display Module - 2.8' Diagonal, 262K TFT, 240 x 320 Pixels w/ 4-Wire resistive overlay
Primary Camera Module - 2.0MP, CMOS, 1/4' Format - Auto-Focus
Secondary Camera Module - VGA, CMOS, 1/6' Format - Fixed-Focus
Samsung Semiconductor -KAL009001M-D1YY - MCP - 2Gb NAND Flash, 512Mb Mobile SDRAM
LG - LGLP-GBKM - Li-Ion Polymer - 3.7V, 1050mAh
Broadcom - BCM2048 - Bluetooth / FM Radio - Single Chip, V2.0+EDR, w/ FM+RDS Radio Receiver
TriQuint Semiconductor - TQM7M5008 - PAM - Quad-Band, GSM/GPRS/EDGE
Materials and Manufacturing ~$151.34
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
LG Relationships / Manufacturing
LG is still experimenting with its outsourcing strategies. So far, LG has retained the majority (over 80%) of its design and manufacturing in house. Only in recent years did LG start to use a number of Taiwanese ODMs for smart phones and low-cost GMS and CDMA phones.
Country of Origin / EMS provider
This product, as a prototype, was not labeled with a country of origin, however from experience, it is assumed the unit was and will be made in Korea. Furthermore, we have assumed that for this model, that PCB was also populated in Korea. However, custom mechanicals (plastics and metals) were sourced in lower cost Taiwan.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as Bluetooth modules or camera modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ?Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Design for Manufacturing / Device Complexity
PDA phones typically are usually electronically more complex, while often being less mechanically complex than other phones (because of the lack of slider or clamshell form factor which simplifies the design).
Overall, the Samsung SGH-i620V has a total component count of 912 components, of which 143 are mechanical in nature. This compares nearly identically to an overall component count of 937 with the Samsung BlackJack. From the mechanical point of view, the BlackJack was already ?heavy" on the mechanical component side coming in at a total mechanical component count of 138.
The number of mechanical components usually is a direct driver of hand-assembly costs, whereas the electronic component count (and I/O count, density, etc.) are relative metrics for the more automated portion (namely SMT assembly) of manufacturing costs.
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
We have seen the recent rapid evolution from EDGE handsets to HSDPA 1.8, then 3.6 and now 7.2Mbps link speeds with HSUPA 5.76Mbps uplink speeds. During this rapid evolution over a period of less than two years - all of the chipsets we have seen have been the same ones from Qualcomm. Those chipsets all revolve around the MSM6275 (1.8Mbps), MSM6280 (3.6Mbps upgradable to 7.2Mbps), and now this MSM7200 (7.2Mbps with HSUPA). We have yet to see a competing solution in the HSDPA space - though we are aware of their existence, it appears that Qualcomm have a very strong position in this segment.
Other noteworthy chips used in this design are the integrated Bluetooth with FM radio single chip solution from Broadcom. All previously seen FM radios had been from NXP.
The primary camera used in this LG device is an auto-focus camera - only the second we have analyzed to date (the first having been 2 years prior to this analysis. In fact, camera modules are interesting in that, despite the rapid progression and evolution of camera resolutions, we have noted that camera architecture has remained very static with most modules being fixed focus with conventional lens kit (3 lens polycarbonate more often than not) and packaging. Despite the improvements in resolution, optics have remained, from our perspective, unevolved.
Main PCB Baseband
Baseband - Qualcomm - MSM7200 - Single Chip, Quad-Band GSM/GPRS/EDGE, HSDPA 7.2Mbps, HSUPA 5.76Mbps, Integrated 400MHz ARM11 Applications Processor & 274MHz ARM9 uProcessor
Battery / Power Management
Power Management IC - Qualcomm - PM7500
MCP - Samsung - KAL009001M-D1YY - 2Gb NAND Flash, 512Mb Mobile SDRAM
RF Transceiver - Qualcomm - RTR6275 - ZIF, Quad-Band GSM/GPRS/EDGE Transceiver and Tri-Band WCDMA 850/1900/2100MHz Transmitter and Single-Band UMTS 1900 or 2100 Receiver
PAM (UMTS) 2100 - Avago - ACPM-7381 - WCDMA/HSDPA 2100MHz, 1920-1980MHz
PAM (GSM) - TriQuint Semiconductor - TQM7M5008 - Quad-Band, GSM/GPRS/EDGE
Bluetooth / FM Radio - Broadcom - BCM2048 - Single Chip, V2.0+EDR, w/ FM+RDS Radio Receiver
Camera Module (Primary)
Module - Manufacturer Unknown
Image sensor - Micron Technology - MT9D112 - 2.0 MP, CMOS, 1/4' Format - 2.20 um x 2.20 um Pixel Size, 3.52mm x 2.64mm Active Image Area
Camera Module (Secondary)
Module - Manufacturer Unknown
Image sensor - Micron Technology - MT9V112 - VGA, CMOS, 1/6' Format - 3.60 um x 3.60 um Pixel Size, 2.30mm x 1.73mm Active Image Area
Primary - 2.8' Diagonal, 262K Color TFT, 240 x 320 Pixels