Overview / Main Features
The HTC Evo 3D is an Android 2.3 (Gingerbread) smartphone with a 4.3 diagonal 3D screen, DUAL 5 MP cameras (to take 3D pictures of course!), 4G (WiMAX) via Sprint's (in the US) network (as well as conventional 3G as a fallback), and a 1.2 GHz Quualcomm SnapDragon processor (MSM8660) which is in Qualcomm's S3 generation of SnapDragon processors (Dual-Core SoC ('Blackbird' marking on die) with Adreno 220 GPU). The Evo 3D also features WiFi (a/b/g), Bluetooth v2.1, as well as a secondary front-facing 1.3MP camera.
The original HTC Evo 4G (WiMAX) was a first (as their marketing campaign espoused) for mobile handsets to feature 4th generation (4G) wireless communication standard, and was offered, in the US, on the Sprint network, and now this new revision of the Evo offers another first - glasses free 3D. The 3D bandwagon is, more than likely (along with it's TV counterpart) to be a gimmick that does not stand the test of time - but for the time being, no potential market will go without it's waters being tested. For the moment though - this relegates the EVO 3D to more of a consumer, rather than business-user space.
This new HTC Evo 3D does have some core commonality with the Evo 4G which we analyzed in Sept 2010: The Evo 3D features a 4.3" diagonal 'parallax barrier' 3D screen - (a 'Super LCD from Sharp Microelectronics) - which 540 x 960 pixel qHD resolution - this falls only a tad short of Apple's 'Retina Display' resolution at 640x960. The parallax barrier is a special technology by which the users two eyes see different sets of pixels through a fine polarized filter - allowing a 3D image to come from the screen without the need for special glasses - though viewing angle and proximity are critical to getting the full effect. As a side note - this technology differs from the lenticular autostereoscopic technology we recently saw on the Nintendo 3DS.
Otherwise, the HTC Evo 3D features WiMAX and CDMA wireless connectivity, but is not a photocopy of the first Eo 4G incarnation though it shares many similarities - including the Sequans chip for WiMAX (SQN1210 - same as last time), and an upgraded Qualcomm SnapDragon processor (MSM8660 in this iteration vs MSM8650 in the last). A few smaller items of interest in the design include a new, previously unseen Qualcomm power management chip (PMM8160) - a not insignificant chip 309 pincount - a lot for a PMIC. The memory that supports core functionality continues to double with each new generation of core processor - and whereas until recently an MCP with 4+4 (Gbs of NAND and DRAM) would suffice - the Evo features an 32+8 MCP (32Gb (bits!) of eMMC NAND Flash + 8Gb of mobile DDR DRAM).
The dual 5MP cameras for taking stereoscopic photos is interesting - and represents a cost tradeoff from the previous 8MP camera module. And although it has little bearing on our hardware analysis it's worth noting that the 3D effect, especially with photos taken directly on the EVO's stereoscopic camera, is impressive. Another cost tradeoff with the first Evo 4G is dropping the HDMI video output.
Pricing - $199.99 with 2 year contract (carrier subsidized) on Sprint at the time of writing (Aug 2011). The original EVO 4G now sells for $99.99 with 2 year contract on Sprint (originally launched at the same $199.99 price point).
Availability - North America (CDMA/WiMax service areas)
For the purposes of this teardown analysis, we have applied a lifetime production volume of approximately 1 M units.
As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
Main Cost Drivers ~76% of Total Materials Cost
Qualcomm - MSM8660 - Apps / Baseband Processor - Dual-Mode, GSM/EDGE/EVDOrB/HSPA+, Dual Core 1.2GHz CPU, Adreno 220 GPU, gpsOne, 45nm
Sharp Microelectronics - LS043T1LE01 - Display Module - 4.3' Diagonal, 16.7M Color Super LCD, 540 x 960 Pixels, w/ Parallax Barrier 3D
Primary Camera Assembly - Contains 2 x 5MP Auto Focus Camera Modules
Samsung Semiconductor - KMKLL000UM-B406 - MCP - 4GB eMMC NAND + 1GB Mobile DDR (Estimated)
Touchscreen Assembly - Capacitive, 4.3' Diagonal, Glass/Film Overlay, Painted, Printed, w/ Integral Flex PCB
Sequans Communications - SQN1210 - Baseband / RF Transceiver - Triple-Band WiMax, SoC, 65nm
SanDisk - MicroSD Memory Card - 8GB
Qualcomm - QTR8615 - RF Transceiver - Dual Mode, GSM/EDGE/EVDOrB/HSPA+, Multi-Band, Integrated Bluetooth & FM, Receive Diversity, 65nm RF CMOS
Unitech - 12-Layer - FR4/RCF HDI, Stacked Via, 4+4+4, Lead-Free, Halogen-Free
Broadcom - BCM4329EKUBG - Bluetooth/FM/WLAN - Single Chip, WLAN IEEE802.11b/g/n, Bluetooth V2.1+EDR, FM Radio Receiver and Transmitter, 65nm
Avago Technologies - AFEM-S257 - Transmit Module - 2.5-2.7GHz WiMax PAM, 2 LNAs & 3 SP2T Antenna Switch
BG86100 - Battery - Li-Ion, 3.8V, 1730mAh
Qualcomm - PMM8160 - Power Management IC
Direct Materials + Manufacturing $231.56
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and in some circumstances the packaging and literature as well.
Country of Origin / Volume Assumptions
Based on device markings, we've based our analysis with the final assembly in Taiwan. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in China.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as wall power charger), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Design for Manufacturing / Device Complexity
The HTC Evo 3D handset has an overall component count of 1202 (excluding box contents) - which incidentally outpaces the 4G Evo with a count of 1060 components. We expected a higher device complexity for a first generation 4G (whether LTE or WiMAX) handset and this HTC and other 4G designs delivered this. Looking specifically at the Main PCB, for example, we see a total of 982 components. As a point of reference, a 3G device such as the HTC 7 Trophy (a Windows 7 phone), the main PCB complexity was only 680 parts.
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
The HTC Evo 3D design revolves, from a cost perspective, as many other devices do (in the 'post iPhone release' age), the user interface elements - with a big budgetary focus on the display and the touchscreen. The iPad is one of the best examples of this focus - where an inordinate amount of the budget and design go into these two elements - which are so critical to user experience. Clearly - when your key feature is a 3D screen (with touch) - you would expect this budgetary phenomena to carry through.
But the Evo 3D, like all other smartphones with flashy features, still requires a solid silicon core to deliver on the promise of the flashy features - and the Qualcomm MSM8660, 3rd generation of SnapDragon processor - now dual-core (ARM v7) operating at 1.2GHz fulfills that role. But a Qualcomm core is rarely designed in without the full contingent of Qualcomm's supporting chips - which, in this case includes a relatively new PMM8160 power management chip (which is really extensive - with a 309 pincount), and a Qualcomm QTR8615 Dual-Mode RF transceiver (GSM/EDGE/EVDOrB/HSPA+).
WiMAX functionality is provided by Sequans Communications' SQN1210 Baseband / RF Transceiver in a single package chip (dual die). Bluetooth and WiFi functionality are provided by the ridiculously ubiquitous Broadcom BCM4329 chip, touchscreen control by the nearly equally ubiquitous Atmel mxT224.
Here is a summary of the major components used in the HTC Evo 3D design:
Display / Touchscreen Module
- Display Module - Sharp Microelectronics - LS043T1LE01 - Parallax Barrier 3D, 4.3' Diagonal Super LCD, qHD 540 x960 Pixels
- Touchscreen Assembly - Capacitive, 4.3' Diagonal, Glass Overlay, Painted, Printed, w/ Integral Flex PCB
Apps / Baseband (CDMA/EVDO) Processing
- Apps Processor - Qualcomm - MSM8660 - Dual-Mode, GSM/EDGE/EVDOrB/HSPA+, Dual Core 1.2GHz CPU, Adreno 220 GPU, gpsOne, 45nm
- SnapDragon Support PMIC - Qualcomm - PMM8160 - Power Management IC
- General PMIC - Texas Instruments - TPS65200YFFR - Li-Ion Battery Charger, Switching Mode, w/ White LED Driver and Current Shunt Monitor
- General PMIC - Texas Instruments - TPS65051RSM - 6 Channel, 2 DC-DC Converters, 4 LDO Regulators
Baseband / RF / PA (WiMAX)
- Baseband / RF Transceiver - Sequans Communications - SQN1210 - Triple-Band WiMax, SoC, 65nm
RF / PA
- RF Transceiver - Qualcomm - QTR8615 - Dual Mode, GSM/EDGE/EVDOrB/HSPA+, Multi-Band, 65nm RF CMOS, w/ Integrated GPS Receiver, & Receive Diversity
- Avago Technologies - Features prominently in the FEM, PAM, and Duplexer areas
Memory (on PCB)
- MCP - Samsung Semiconductor - KMKLL000UM-B406 - 4GB eMMC NAND + 1GB Mobile DDR
- (Comes bundled with MicroSD 8GB card)
User Interface (and Sensors)
- Touchscreen Controller - Atmel - mXT224 - Capacitive, 12-bit, 224-Channel Configuration, 400KHz, w/ I2C Interface
- HD Audio & Video Interface IC - Silicon Image - SiI9244 - TMDS Core, 1MHz I2C Bus
- Audio Codec - Texas Instruments - TLV320AIC3254IRHB - Stereo, w/ Embedded 2 miniDSP Cores
- Gyroscope - Invensense - MPU-3050 - 16-Bit, 3-Axis, Digital Output, w/ Integrated Temperature Sensor
- eCompass - AKM Semiconductor - AK8975B - Electronic Compass - 3-Axis, ADC, 13-Bit Digital Output
- Accelerometer - MEMS 3-Axis, 2g/4g/8g, Digital Output
- Primary Camera - 2D/3D, Dual 5.0MP CMOS, 1/3.6' Format, Auto Focus Lens
- Secondary Camera - 1.3MP, 1/6' Format, Fixed Lens