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Mobile Devices

HTC MTeoR Mobile Phone Teardown

08 August 2007
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Main Features

Mid to high-end 3G UMTS 2100 / tri-band GSM/GPRS/EDGE smartphone with built-in Windows Mobile 5.0. Main features include a 1.3MP camera, a 2.2' 240x320 65K color TFT display, a MicroSD memory extension slot. The phone also have built-in Bluetooth V1.2 connectivity, direct push email for instant email access and documents (Word, Excel, Powerpoint & PDF) viewing.

HTC MTeoR Mobile Phone Main ImageHTC MTeoR Mobile Phone Main Image

Overview

The HTC MTeoR is marketed as the first 3G Windows Mobile 5.0 smartphone. One may think that being the first would mean a large, bulky phone. However, with the 3G connectivity, Windows Mobile 5.0 built-in, a large display and other features, the phone is still compact enough to be a pocketable smartphone.

Target Market

Per HTC press release, 'It will appeal to heavy messaging and business'.

Note this product will primarily be focused on those regional markets with broad WCDMA/UMTS network coverage (Europe).

HTC MTeoR Mobile Phone (iSi) - Enclosure DisassemblyHTC MTeoR Mobile Phone (iSi) - Enclosure Disassembly

Released

Per HTC press release - Late July 2006.

Pricing and Availability

~ ?50 from web sites redirected from HTC official site. Available across Europe per HTC press release

Volume Estimations

3G smartphones although are not as new as HSDPA phones on the market, still have not penetrated too much into the worldwide market. Also, based on HTC market share, we are therefore assuming a relatively low lifetime production volume of approximately 190K units for this model. This estimate based on the assumption of 2 year life span maximum.

As a reminder, volume production assumptions are not meant to be necessarily 'market accurate' and our meant primarily to be used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially).

ISuppli's Design Forecast Tool (DFT) and Market Shares

As part of iSuppli's Design Forecast Tool (DFT), we forecast handset shipments by major design feature and manufacture, as well as the number of design starts a manufacturer will have by feature set.

From our most recent revision of this tool iSuppli estimates shipments of 56 million WCDMA 2100 tri-band EDGE (900/1800/1900) handsets in 2007 in the global market, and furthermore we estimate 16 million Windows based mobile phones in 2007.

Function / Performance

Functional testing was not performed on the HTC MTeoR

HTC MTeoR Mobile Phone Cost AnalysisHTC MTeoR Mobile Phone Cost Analysis

Cost Notes

Main Cost Drivers Representing ~70% of total materials cost

Qualcomm - MSM6275 - Baseband Processor - Single Chip, Quad-Band GSM/GPRS, GPS, UMTS, HSDPA & Bluetooth

Samsung Semiconductor - SC32442AL-33S - Application Processor w/ Stacked Memory MCP - ARM920T Core, 1Gb NAND Flash, 512Mb Mobile SDRAM

Display Module - 2.2' Diagonal, 65K Color TFT, 240 x 320 Pixels

Camera Module - 1.3MP CMOS, 1/4' Format - Fixed Lens

Samsung Semiconductor - K5D5657ACA-D090 - MCP - 256Mb NAND Flash + 256Mb Mobile SDRAM

Xilinx - XC2C128-7CP132C - CPLD - CoolRunner-II, 128 Macrocells, 100 I/Os, 0.18um

Unitech - - 8-Layer - FR4/RCF HDI, 2+4+2

Celxpert - BREE160 - Battery - Li-Ion Polymer, 3.7V, 1190mAh

Qualcomm - RTR6250 - RF Transceiver - ZIF, Quad-Band GSM/GPRS Transceiver and Tri-Band UMTS 800/1900/2100MHz Transmitter

Delta - ADP-5FH - Charger - 5.0V, 1A

Qualcomm - PM6650 - Power Management IC

Texas Instruments - BRF6150 - Bluetooth - Single Chip Solution, V1.2, 130nm Process

Qualcomm - RFR6250 - RF Receiver - ZIF, Dual Band WCDMA (UMTS) 1900 & 2100MHz, GPS

Total BOM Costs $139.26

Total BOM & Manufacturing Costs $149.42

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing and test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself ?cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

HTC Relationships / Manufacturing

HTC is an important ODM partner offering smartphones and PDAs to a number of international service providers, including Vodafone. Vodafone is in fact one of HTC top customers. We believe that HTC are producing most of their phones in house. In fact, iSuppli globally sees that about 80% of handsets (all manufacturers mixed) in 2006 are produced n-house?by handset OEMs or ODMs, with a growing percentage of EMS-produced devices. HTC, as a Taiwanese company is assumed in our teardown analysis to produce, when possible, and where noted on the labels in mainland China, and sometimes in Taiwan.

Country of Origin / Volume Assumptions

This product is labeled as Made in Taiwan. However, we have assumed that for the MTeoR, due to lower labor rate and production cost, the PCB was populated in China and custom mechanicals (plastics and metals) we have also assumed to be sourced in China.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as chargers), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

The issue of labor rates was revisited in Q2 2006 as we began to apply some research by one the major worldwide EMS suppliers and are now applying some of their research on total loaded costs by country and region to arrive at these new rates which are pronouncedly higher on the low end in China. Remember that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines.

Design for Manufacturing / Device Complexity

Of all the smart phones analyzed this quarter, the MteoR is the more complex by virtue of having, by far the highest total component count. At a component count of 1148 this smart phone is in the same realm as PDAs previously seen (but still doesn match HTC own XDAIII ?which featured nearly 1500 total components). This component count, and the mechanical count of 127 components, still is very high for a non clamshell or slider form factor device. Previously analyzed HTC devices tended to suffer from lack of design integration, which may be an inevitable by-product of focusing on high-end smartphones, and simply correlate directly to the added functionality.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design notes

So far we haven analyzed too many 3G smartphone. However, including the MTeoR, most of them are designed based on a 3G phone core, for example, a Qualcomm chipset, plus an additional applications processor. The MteoR has a Samsung applications processor which has stacked MCP memory to help saving PCB real-estate.

In the phone core, Qualcomm's MSM6275 chipset is used from baseband to RF which includes the MSM6275 itself, PM6650 power management IC, RTR6250 quad-band GSM transceiver and UMTS transmitter and RFR6250 UMTS receiver. In many of the 3G phones we have seen, especially in Samsung's and other relatively small manufacturer's design, Qualcomm has been a prime player in baseband and RF section due to its relatively simple reference design and highly integrated single-chip baseband chip.

The MTeoR features 2 PAMs, one for the quad-band GSM EDGE and one for the UMTS band. The GSM PAM is a TriQuint Semiconductor TQM7M5003 which we have seen in the very recent Samsung BlackJack. The UMTS PAM is an Anadigics AWT6277RM20P8.

The memory section is a NOR-less design which wee seen mostly in Samsung phones.

Overall, the MTeoR is similar to a typical Samsung 3G device with Qualcomm, TriQuint and Anadigics being the prime supplier for the major ICs with a NOR-less memory design.

Here is a summary of the major components used in the HTC MTeor design:

Main PCB

MPU

  • Samsung Semiconductor - Application Processor w/ Stacked Memory MCP - ARM920T Core, 1Gb NAND Flash, 512Mb Mobile SDRAM

Baseband

  • Baseband - Qualcomm - MSM6275 - Single Chip, Quad-Band GSM/GPRS, GPS, UMTS, HSDPA & Bluetooth

Battery / Power Management

  • Power Management IC - Qualcomm - PM6650
  • Power Management IC - Texas Instruments - TPS65021RHA

Memory

  • MCP - Samsung Semiconductor - K5D5657ACA-D090 - 256Mb NAND Flash + 256Mb Mobile SDRAM

RF/PA

  • PAM (GSM) - TriQuint Semiconductor - TQM7M5003 - Quad-Band, GSM/GPRS/EDGE
  • PAM (WCDMA) - Anadigics - AWT6277RM20P8 - WCDMA, 1920MHz - 1980MHz
  • RF Transceiver (GSM/UMTS) - Qualcomm - RTR6250 - ZIF, Quad-Band GSM/GPRS Transceiver and Tri-Band UMTS 800/1900/2100MHz Transmitter
  • RF Receiver - Qualcomm - RFR6250 - ZIF, Dual Band WCDMA (UMTS) 1900 & 2100MHz, GPS
  • Antenna Switch Module - Kyocera - LX-P612S2 - Quad-Band, GSM850/EGSM900/DCS1800/PCS1900

User Interface

  • Texas Instruments - BRF6150 - Bluetooth - Single Chip Solution, V1.2, 130nm Process
  • AKM - AK4641 - Codec - Audio, 16-Bit, Mono, w/ Bluetooth Interface

Camera Module

  • Image sensor - OmniVision - OV9650 - 1.3MP, CMOS, 1/4' Format - 3.18um x 3.18um Pixel Size, 4.13mm x 3.28mm Active Image Area

Display Module

  • 2.2' Diagonal, 65K Color TFT, 240 x 320 Pixels

HTC MTeoR Mobile Phone (iSi) - Box ContentsHTC MTeoR Mobile Phone (iSi) - Box Contents



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