Acquired Electronics360

Mobile Devices

Grandstream GXP2200 Enterprise IP Phone Teardown

01 July 2013
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Summary Points

Mid-to-high range desktop SIP phone running on Android platform
4.3' 480x272 pixel capacitive touchscreen color TFT LCD
Android Operating System 2.3
Dual 10/100/1000Mbps network ports with integrated PoE, Bluetooth, USB, SD
Full-duplex speakerphone

Grandstream GXP2200 Enterprise IP Phone Main ImageGrandstream GXP2200 Enterprise IP Phone Main Image

Target Market

Small business / Enterprise

Released

Oct 2012 per press release

Grandstream GXP2200 Enterprise IP Phone - Main PCB TopGrandstream GXP2200 Enterprise IP Phone - Main PCB Top

Pricing and Availability

$239 USD MSRP

Worldwide

Volume Estimations

400,000 Annual Production Volume
5 Product Lifetime (Years)

For the purposes of this teardown analysis, we have assumed an Annual Production Volume of 400000 units and a Product Lifetime Volume of 5 year(s).

Teardown volume and production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

Grandstream GXP2200 Enterprise IP Phone - Main PCB BottomGrandstream GXP2200 Enterprise IP Phone - Main PCB Bottom

Cost Notes

Total BOM: $69.08
Top Cost Drivers below: $44.04
% of Total BOM 64%

Main Cost Drivers below

DSP Group - DMW96MB321AY1ABC-1X - Communications Processor - IP Phone SoC, 1GHz ARM Cortex-A8 Core, 300MHz ARM926 Core- (Qty: 1)
K&D Optoelectronics - KD43G18-40NB-A59 - Display Module - 4.3' Diagonal, 262K Color TFT (TM Mode), 480 x 272 Pixels, 198um x 198um Pixel Size, 95.04mm x 53.86mm Viewable Area, 350 cd/m^2- (Qty: 1)
Display Window / Touchscreen Assembly - 4.3' Diagonal, Capacitive, Glass-Film-Film Type, w/ FocalTech FT5306DE4 Touchscreen Controller- (Qty: 1)
Nanya - NT5TU128M8GE-AC - SDRAM - DDR2-800, 1Gb, 1.8V- (Qty: 4)
Sandisk - SDIN5C1-4G - Flash - eMMC iNAND, 4GB, MLC- (Qty: 1)
Mass Power - AC Adapter - 12V, 1.5A, w/ 2.55m Cord- (Qty: 1)
Aoshikang Precision Circuit - 6-Layer - FR4, Lead Free- (Qty: 1)
Realtek - RTL8363SB - Ethernet Controller - Gigabit LAN, 3-Port- (Qty: 1)
Dongguan TNK Industry - QT48A03 - Ethernet Magnetics Module - Dual Port, 10/100/1000 Base-T- (Qty: 1)
On Semiconductor - CAT5128TBI-50GT3 - Potentiometer - Digital, 32-Tap- (Qty: 5)

Grandstream GXP2200 Enterprise IP Phone Cost AnalysisGrandstream GXP2200 Enterprise IP Phone Cost Analysis

Not Included in Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

We do provide an Excel tab 'Overall Costs' where a user can enter their known pre and post production costs to build a per unit cost reflective of theirs actual expenditures.

Country of Origin

For the purposes of this analysis, we are assuming the following country(ies) of origin for each level of assembly, based on a combination of 'Made In' markings, and/or assumptions based on our knowledge of such equipment.

Box Contents - China
Display - China
Main PCB - China
Misc Interface PCBs - China
Other - Enclosures / Final Assembly - China
Touchscreen - China

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as display modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Grandstream GXP2200 Enterprise IP Phone - Disassembly View 1Grandstream GXP2200 Enterprise IP Phone - Disassembly View 1

Design Complexity

Component counts by assembly and the number of assembly are indicators of design complexity and efficiency.

Component Qty: 695 - Main PCB
Component Qty: 83 - Other - Enclosures / Final Assembly
Component Qty: 18 - Box Contents
Component Qty: 2 - Display
Component Qty: 10 - Touchscreen
Component Qty: 2 - Misc Interface PCBs
Component Qty: 810 - Grand Total

The average IP phone has about 700 components making this device on the more complex side to produce.

Grandstream GXP2200 Enterprise IP Phone - Box ContentsGrandstream GXP2200 Enterprise IP Phone - Box Contents



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Nov-01 Dec 2017 Helsinki, Finland
23-27 Apr 2018 Oklahoma City, Oklahoma
18-22 Jun 2018 Honolulu, Hawaii
Find Free Electronics Datasheets
Advertisement