Main Features / Overview
The Samsung SGH-X510 is an entry-level tri-band clamshell phone with very small dimensions and weight (88x 44.5 x 19.8mm, weight 75.5g). This model appears (functionally and internally) to be the clamshell version of the recently analyzed SGH-C130. It comes with a 1.77-inch 128x1260 pixels 65K TFT display, a VGA camera, polyphonic ringtones (16), speakerphone function and a vibrating alert.
Entry-level phone, destined to be a give-away phone in some markets, for first-time mobile phone users, and also emerging market consumers.
Official press release not found - secondary sources on web show releases in Q4 2006.
Pricing and Availability
Available online unlocked for as low as ~$110 at the time of writing (August 2007).
Based on Samsung's market share, and our estimates of market volume shipments by manufacturers and market segments (see iSuppli Design Forecast Tool (DFT) data below), we are assuming a total production volume for this model of 1.5 million units over a two-year lifespan for the purpose of this analysis.
As a reminder, teardown volume production assumptions are meant primarily to be used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2 million) rarely have a large net effect on our final analysis because of this.
As part of iSuppli's Design Forecast Tool (DFT), we forecast handset shipments by major design features and manufacturer, as well as the number of design starts a manufacturer will have by feature set.
From our most recent revision of this tool iSuppli estimates unit shipments of 408 million GPRS handsets in the 2007 global market, and we further estimate unit shipments of 168 million tri-band 900/1800/1900 handsets in the 2007 global market.
Function / Performance
Functional testing was not performed on the Samsung SGH-X510.
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing and test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
Samsung Relationships / Manufacturing
Samsung makes all of its mobile phones in-house. About 70% of its products are made in Korea and 30% are made in lower-cost countries such as China and India. Until 2006, Samsung had been designing and manufacturing (box build) its mobile phones in-house although this approach seems to be changing with Samsung starting to approach EMS providers and ODMs to explore low-cost phone options.
Country of Origin / Volume Assumptions
This product is labeled as "Made by Samsung. Since most of Samsung's phones simply say they are made in Korea, we are guessing that this is its manner of hiding Chinese origins. So we are assuming this device was made in China, and furthermore, we have assumed that for this model, that the PCB was also populated in China, and that custom mechanicals (plastics and metals) were also sourced domestically in China.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of ""finished" sub-assemblies (such as Bluetooth modules or camera modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand-inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ""Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Design for Manufacturing / Device Complexity
Most of the phones we have seen that are either clamshell or ""slider" have higher components counts due to additional mechanical and electro-mechanical complexity owing to the ""splitting" of the design into two ""halves."
In the case of the Samsung SGH-X510, this device has a total component count of 520 components of which 103 are mechanical. This is in-line with other phones of similar functionality in clamshell form factor.
The number of mechanical components usually is a direct driver of hand-assembly costs, whereas the electronic component counts (and I/O count, density, etc.) are relative metrics for the more automated portion (namely SMT assembly) of manufacturing costs.
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
The core design of the SGH-X510 is very similar to the recently analyzed SGH-C130, and features the same chips across the board. The core design features two Agere baseband chips. Agere baseband used to be quite common in Samsung phones designs but seems to have faded recently until we saw these two in the SGH-C130 and this SGH-X510. The PA is a dual-band unit from TriQuint that integrates the antenna switch to ease the overall design. The RF transceiver is a fairly typical Si-Lab's Si4210-GM for this level of phones. A Yamaha YMU759C FM sound generator, which is believed to be a variant of the popular (among non-Samsung design though) YMU759B, is present in the user interface section. In fact, Samsung had been mostly using the YMU762 and YMU765 in their previous designs.
The following is a summary of the major components used in the Samsung SGH-X510 design:
- DBB - Agere Systems (LSI) - TR09WQTKE3B - Digital Baseband Processor
- ABB - Agere Systems (LSI) - CSP2200B1 - Analog Baseband / Power Management
- MCP - Sharp Microelectronics - LRS18C8A - 128Mb NOR Flash, 32Mbit PSRAM, 1.8V
- RF Transceiver - Silicon Laboratories - Si4210-GM - Quad-Band, GSM/GPRS/EDGE
- Transmit Module - TriQuint Semiconductor - TQM6M4022 - PAM - Dual Band GSM/GPRS 900/1800, w/ Power Control & Integrated SP4T Antenna Switch
- FM Sound Synthesizer - Yamaha - YMU759C
- Camera Module - Manufacturer Unknown
- Image Sensor - SiliconFile - NOON030PC20 - VGA, CMOS, 1/7.4-inch Format - 3um x 3um Pixel Size, 1.92mm x 1.44mm Active Image Area
- 1.8-inch Diagonal, 65K CSTN, 128x160 Pixels