Overview / Main Features
The HP ProLiant BL260c G5 is an entry level c-Class server blade available within the ProLiant line of server blades. The BL260c features Intel 5100 chipset and a Broadcom BCM5715 ethernet controller.
- Up to two Intel® Xeon® Quad-Core sequence processors delivering ultimate processor performance with eight cores using larger and better optimized 12 MB L2 cache
- Up to 48GB of ECC 667MHz DDR2 Registered DIMMs resulting in greater performance per watt
- One PCIe mezzanine expansion slot - X8, type 2 and integrated x4 PCIe support for hard disk drive storage expansion
- Integrated Lights Out 2 (iLO 2) Management for unprecedented, high-speed management which includes virtual KVM and graphical remote console at no additional cost
- HP iLO Power Management Pack software delivers centralized control of server power consumption and thermal output, reliable security, and energy savings
- HP Power Regulator provides an innovative operating system-independent power management feature for server power consumption and system performance to meet critical business needs
- HP Insight Control Environment for HP BladeSystem provides comprehensive system health, remote control, vulnerability scanning and patch management as well as flexible deployment and power management in an easy to install software suite
Note that this server blade under analysis was not configured with CPUs, DIMM memory cards or storage drives and therefore were left out of the bill of materials (BOM).
c-Class portfolio of server blades (specifically the BL260c G5 was) announced in March 2008 for immediate availability.
Pricing - Will vary based on configuration. However, for the configuration we received (with no CPUs, Memory nor drives included) there are no pricing available from HP. The closest proxy for this particular configuration would be the base model with one CPU and minimal memory configuration. In that case, the server blade cost approximately $600 at the time of writing - Jan 2009).
Availability - Assumed to have global availability.
For the purposes of this teardown analysis, we have assumed a lifetime production volume of 250K units.
As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
iSuppli expects strong unit shipment growth overall in the server area for the foreseeable future according to a recent topical report, with combined worldwide sales approaching 8.6 million units in 2007 (growing 8.4% to roughly 9.3 million in 2008, or a CAGR of 7.4% from 2006 to 2011 for the whole server market). Specifically for blade servers, iSuppli projects that this category will grow at a significantly faster CAGR of 31.5% from 2006 to 2011 spurn on by the popularity of server virtualization technologies as well as the overall form factor efficiencies of the blade server format.
According to an iSuppli topical paper titled ""Blade Servers and Virtualization Overview - Q3 2008", HP leads in blade server shipments in 2007 with 43.6% (up from 39.3% in 2006) overtaking IBM at 38.3% market share. Dell rounds out the 3rd spot with 9.5% market share.
Major Cost Drivers (Representing ~67% of Total Direct Materials Costs)
Intel - QG5100MCHSLARL - Northbridge - Memory Controller Hub
Gold Circuit Electronics - 12-Layer - FR4
Intel - NH82801IRSLA9N - Southbridge - I/O Controller Hub (ICH9)
Enclosure, Main, Bottom - Stamped/Formed Metal, w/ 7 Metal Pins, 2 Threaded Metal Inserts & 1 Threaded Metal Stud
AMD - ES1000 - GPU - 2D, 200MHz Core, 32-Bit 33/66MHz PCI 2.2, 16-Bit 256MB DDR-II SDRAM Support, Dual CRT Support
HP - 353821-504 - Lights-Out Management Processor
Broadcom - BCM5715SKPBG - Ethernet Controller
Heatsink/Cooler Assembly - Stainless Steel Plate & Fins, w/ Metal Tubes, w/ Thermal Paste, & 4 Spring-Loaded Mounting Screws
Lattice Semiconductor - LCMX01200C-3FTN256C - PLD - 1200 LUT's, 211 I/O's, 6.25Kb RAM, 1 PLL, 1.2/1.8/2.5/3.3V
FCI - 10054783-001 - Mezzanine Board to Board Header - Vertical, High Profile
CPU Socket - LGA771, w/ Shepherd Hook Lever (Qty:2)
Molex - 75360-0018 - Backplane Connector
International Rectifier - IR3505MTRPBF - Power Controller - XPhase3 Phase IC (Qty:8)
Enclosure, Main, Top - Stamped/Formed Metal, w/ 4 Metal Pins, 1 Stamped/Formed Metal Release Button, and 1 Stamped/Formed Metal & Lexan Polycarbonate Shield/Insulator
Materials and Manufacturing $238.95
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
OEM/ODM/EMS Relationships / Manufacturing
Per iSuppli's own Global OEM Manufacturing and Design Analysis (GOMDA) report (Q2, 2008) HP outsources nearly 80% of servers to EMS providers and ODMs (the latter representing nearly 60% of the HP server business overall). Most of HP servers outsourced to ODMs are to Inventec [with over 40% of overall share of servers shipped] and Flextronics. This unit claims, per it's labeling to be made in the US of foreign components - so this may still encompass the motherboard itself, which we are assuming is made in China for this analysis.
Country of Origin / Volume Assumptions
Based on OEM/ODM/EMS relationships, it is assumed that the HP server blade was manufactured in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc. were also sourced in China.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as heat sinks), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ""Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pin count of the device. This calculation is affected by country or region of origin as well.
Design for Manufacturing / Device Complexity
The HP ProLiant BL260c server blade has a component count of 2856 excluding box contents (153 of which are mechanical in nature). In comparison to other server blades analyzed by iSuppli, the BL260c contains about half as many components.
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
Here is a summary of the major subsystems and components in the HP ProLiant BL260c sever blade:
- Northbridge - Memory Controller Hub - Intel - QG5100MCHSLARL
- Southbridge - I/O Controller Hub - Intel - NH82801IRSLA9N
- Ethernet Controller - Broadcom - BCM5715SKPBG
- GPU - AMD - ES1000
- Lights-Out Management Processor - HP - 353821-504
- I/O Controller - SMSC - SCH4307-NS
- PLD - Lattice Semiconductor - LCMX01200C-3FTN256C
- SDRAM - ESMT - M12L128324A-7TG
- SDRAM - Micron Technology - MT47H32M16BN-37E