Overview / Main Features
The Toshiba Portege R700 is a business-oriented notebook computer powered by an Intel Core i3-350M processor and HM55 Express Chipset. This 13.3 inch laptop under analysis is configured with 2GB of DDR3-1066 of memory [on single SO-DIMM module], a 500GB hard-disk drive, Broadcom 802.11n-capable WLAN module, as well as a lithium ion 6-cell battery. Also, the Toshiba Portege R700 comes with a CD/DVD RW optical drive and an integrated 1.3MP webcam.
Business / Enterprise
Per press releases, first release in June 2010.
Pricing - The Toshiba Portege R700 is listed on the Toshiba US website for approximately $899 (however, this configuration comes with 4GB of memory).
Availability - Assumed global
For the purposes of this teardown analysis, we have assumed a lifetime production volume of 900,000 units.
As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
Main Cost Drivers Representing ~82% of total materials cost
Intel - CN80617004161AC - CPU - Intel Core i3-350M Processor, Dual Cores, 2.26GHz, 3MB L3 Cache, 32nm Process
Panasonic - UJ892 - DVD/CD RW Drive - Slim Internal Type, Tray Load, SATA
Hitachi - HTS545050B9A300 - Hard Drive - 500GB, 2.5', SATA 3.0Gb/s, 5400RPM, 8MB Buffer
Toshiba - LT133EE09D00 - Display Module Value Line Item - 13.3' TFT LCD, TN Mode, 1366 x 768 Pixels, LED Backlight
PA3832U-1BRS - Battery Pack - Li-ion, 6-Cell, 10.8V, 5800mAh, 66Wh
Samsung Semiconductor - M471B5673FH0-CF8 - SO-DIMM DDR3-1066 - 2GB, 256Mbx64, 1.5V
Intel - BD82HM55SLGZS - Platform Controller Hub - HM55 Express Chipset, 65nm Process, 3.5W, w/ Integrated Graphics
UniMicron Technology - 8 Layer - FR4, Lead-Free
Delta Electronics - PA3714E-1AC3 - AC Adapter - 19V, 3.42A, 65W, w/ 6ft Cord & Velcro Strap
Broadcom - BCM94313HMGB - WLAN / Bluetooth Module Value Line Item - IEEE802.11b/g/n Single- Stream, Bluetooth V2.1+EDR
Webcam PCB - Contains 1.3MP (Assumed) Camera Module, USB2.0 PC Camera Controller, 64Kb EEPROM
Keyboard Assembly - Injection Molded Plastic Keys, Mounted on Metal Backing Plate, w/ Interconnect Flex
Cooler Assembly - Stamped / Formed Metal Mounting Bracket, Stamped / Formed Metal Plate, Copper Tube, Aluminum Fins
Enclosure, Display, Top - Die-Cast Magnesium Alloy, Painted, w/ Insert-Molded Plastic
Enclosure, Main, Bottom - Die-Cast Magnesium Alloy, Painted, Printed
Enclosure, Main, Top - Die-Cast Magnesium Alloy, Painted, Printed, Brushed
Synaptics - Touchpad Assembly
Maxim - MAX17428GTJ+ - Power Supply Controller - Step-Down, Quick-PWM, 1-Phase, for Intel notebook CPUs
Maxim - MAX17434GTL+ - PWM Controller - Dual Phase, w/ Transient Suppression, for IMVP6+/IMVP6.5
Materials and Manufacturing $433.05
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
Toshiba's Mobile PC manufacturing profile, according to iSuppli's Global OEM Manufacturing and Design Analysis - GOMDA), is 14.8% In-house and 85.2% outsourced with Inventec, Compal and Quanta, accounting for 38.8%, 31.2% and 14.1% respectively of their out-sourced output capacity.
Country of Origin / Volume Assumptions
Based on markings, the unit was likely assembled in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in China.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as display module), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Design for Manufacturing / Device Complexity
The Toshiba Portege R700 has an overall component count of 2158 (excluding box contents), of which 1426 resides on the motherboard. This level of complexity is on par with comparable notebook computers we have analyzed in this category.
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
Here is a summary of the major components used in the Toshiba Portege R700 Laptop design:
- Display Module - Toshiba - LT133EE09D00, 13.3' TFT LCD, TN Mode, 1366 x 768 Pixels, LED Backlight
- Platform Controller Hub (HM55 Express Chipset) - Intel - BD82HM55SLGZS, 65nm Process, 3.5W, with Integrated Graphics
- Core i3-350M Processor - Intel - CN80617004161AC, Dual Cores, 2.26GHz, 3MB L2 Cache, 32nm Process
I/O & Interface
- Embedded Controller - SMSC - MEC1609-PZP
- Microcontroller - Toshiba Semiconductor -TMP86FS49BUG
- Memory Card Reader Controller - Ricoh - R5U230
- Ethernet Controller - Intel - WG82577LC, 10/100/1000 Mbps, PCI Express Interface
- PWM Controller - Maxim - MAX17434GTL+
- Power Supply Controller - Maxim - MAX17428GTJ+
- Clock Generator - IDT - 9LVRS394CKLF
- SO-DIMM DDR3-1066 - Samsung Semiconductor - M471B5673FH0-CF8, 2GB, 256Mbx64, 1.5V
- WLAN / Bluetooth Module - Broadcom - BCM94313HMGB
- DVD/CD RW Drive - Panasonic - UJ892, Slim Internal Type, Tray Load, SATA
- Hard Drive - Hitachi - HTS545050B9A300500GB, 2.5', SATA 3.0Gb/s, 5400RPM, 8MB Buffer
- Battery Pack - Li-ion, 6-Cell, 10.8V, 5800mAh, 66Wh