1U Rack mount unit - 'Universal Access Router'
Fan-less passive cooling
16 TDM (T1/E1), 8 copper GbE (with PoE), two GbE SFP ports, two 10 GbE SFP+ ports.
Complex system with multiple PCBAs and subsystems
Broadcom BCM56334 24 Port Ethernet Switch
PMC WP3TA1C1211FI-B1 Network processor, Freescale P202GSXN2KFBC Communications processor
Mobile backhaul (Service providers) - Primarily
Q1 2012 ACX Series introduced
> $10K Only one online price source found
5,000 Annual Production Volume
7 Product Lifetime (Years)
For the purposes of this teardown analysis, we have assumed an Annual Production Volume of 5000 units and a Product Lifetime Volume of 7 year(s).
Teardown volume and production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
Total BOM: $774.11
Top Cost Drivers below: $450.97
% of Total BOM 58%
Main Cost Drivers below
Lattice Semiconductor - LFE3-95EA-7FN672I - FPGA - 92K LUTs, 4.608Mb SRAM, 8-Channel Serializer/Deserializer, 380 I/Os- (Qty: 1)
Broadcom - BCM56334LB1IFSBG - Ethernet Switch - 24-Port, 10/100/1000Mbps, w/ 4 10GbE/HiGig2 Ports- (Qty: 1)
Tsuding Global Electronic - 12-Layer - FR4- (Qty: 1)
Xilinx Inc. - XC6SLX75T-2FGG484BI - FPGA - 74637 Logic Cells, 3096Kb RAM, 408 User I/Os- (Qty: 1)
Delta Electronics - Q36SR12017NNFA - DC-DC Converter - 12V, 17A, 18V-75V Input, Negative Logic On/Off Control, Fourth-Brick, 93% Efficient- (Qty: 1)
PMC Sierra - WP3TA1C1211FI-B1 - Network Processor- (Qty: 1)
Freescale Semiconductor - P202GSXN2KFBC - Communications Processor- (Qty: 1)
Murata - EPH-54/3-Q48NB-C - DC-DC Converter - 54V, 3A, 18-72V Input, Negative Logic On/Off Control, Half-Brick- (Qty: 1)
IDT - 88P2288BBG - Framer - Octal, T1/E1/J1, w/ Long Haul / Short Haul Transceiver- (Qty: 2)
Thermal Transfer Pad - Silicone Elastomer, Die-Cut, w/ PSA- (Qty: 29)
Not Included in Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
We do provide an Excel tab 'Overall Costs' where a user can enter their known pre and post production costs to build a per unit cost reflective of theirs actual expenditures.
Country of Origin
For the purposes of this analysis, we are assuming the following country(ies) of origin for each level of assembly, based on a combination of 'Made In' markings, and/or assumptions based on our knowledge of such equipment.
Interface PCB - China
Main PCB - China
Other - Enclosures / Final Assembly - China
Power Supply PCB A - China
Power Supply PCB B - China
Processor PCB - China
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as combo modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Component counts by assembly and the number of assembly are indicators of design complexity and efficiency.
Component Qty: 4283 - Main PCB
Component Qty: 107 - Other - Enclosures / Final Assembly
Component Qty: 826 - Processor PCB
Component Qty: 96 - Power Supply PCB A
Component Qty: 160 - Power Supply PCB B
Component Qty: 53 - Interface PCB
Component Qty: 5525 - Grand Total