Acquired Electronics360

Mobile Devices

HTC Touch HD2 Mobile Phone Teardown

07 October 2010
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Overview / Main Features

The HTC Touch HD2 is Windows Mobile (6.5) smartphone powered by a Qualcomm 1GHz SnapDragon processor which also features a large 4.3 inch LCD display. Much like the current trends of growing display sizes on the high end mobile devices, the HTC HD2 attempts to improve usability of smartphones by providing yet larger screen real estate.

The Touch HD2 features a first for Windows Mobile device: a capacitive touchscreen which we have seen now for over 3 years on the Apple iPhone as well as various Palm, Blackberry and Android devices. The HD2 features a very similar design to the Toshiba TG01 which we have previously analyzed that also features a heavy reliance on Qualcomm components.

Overall, the dual band UMTS and quad band GSM is designed for the North American market featuring the AWS spectrum compatibility for T-Mobile 3G network. The smartphone features a 5MP camera, WiFi, Bluetooth and GPS capabilities which has become the standard features set of high end mobile devices.

HTC Touch HD2 Mobile Phone Main ImageHTC Touch HD2 Mobile Phone Main Image

Target Market

Smartphone Users

Released

Per press release, first release in early 2010 on the T-Mobile (US) network.

HTC Touch HD2 Mobile Phone - Main PCB TopHTC Touch HD2 Mobile Phone - Main PCB Top

Pricing and Availability

Pricing - At the time of writing (Aug. 2010), T-Mobile US is offering the HD2 for a suggested retail of $449.99 or $149.99 with a 2 year contract.

Availability - North America

Volume Estimations

For the purposes of this teardown analysis, we have assumed a lifetime production volume of 500K units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

HTC Touch HD2 Mobile Phone - Main PCB BottomHTC Touch HD2 Mobile Phone - Main PCB Bottom

Cost Notes

Main Cost Drivers Representing ~80% of total materials cost

Qualcomm - QSD8250 - Baseband Processor - Quad-Band GSM/GPRS/EDGE, UMTS HSPA, 1GHz CPU, 600MHz DSP, WiFi, Bluetooth, gpsOne, 3D Graphics, Mobile Broadcast TV

Sharp Microelectronics - LQ043Y1DX01 - Display Module Value Line Item - 4.3' Diagonal, 16.7M Color LCD, 480 x 800 Pixels

Samsung Semiconductor - KBY00U00VM-B450 - MCP - 4Gb NAND Flash + 3Gb Mobile SDRAM (Estimated)

Elan Microelectronics - IW1004A - Touchscreen Assembly / Display Window - 4.3' Diagonal, Capacitive, Glass Overlay, Painted, Printed

Camera Module Value Line Item - 5.0MP CMOS, 1/3.2' Format, Auto Focus Lens

Broadcom - BCM4329EKUBG - Bluetooth/FM/WLAN - Single Chip, WLAN IEEE802.11a/b/g/n, Bluetooth V2.1+EDR, w/ FM Radio Transceiver

Panasonic - 10-Layer - FR4 HDI, Stacked Via

Battery - Li-Ion, 3.7V, 1230mAh

Qualcomm - PM7540 - Power Management IC - w/ Integrated USB Transceiver

Qualcomm - RTR6285 - RF Transceiver - ZIF, Quad-Band GSM/EDGE, Tri-Band UMTS Transceiver, HSDPA, w/ Integrated GPS Receiver & Receive Diversity

Handsfree Accessory - Stereo, w/ Media Control Button, w/ Label & Rubber Band & Plastic Clip

UniMicron Technology - 4-Layer - Rigid/Flex Hybrid, FR4/Kapton

Delta Electronics.Inc - EADP-5LB A - Charger - 5V, 1A, AC to USB Type A

Enclosure, Main, Top - Stamped / Formed Stainless Steel, 4-Piece, 25 Laser Welds Points, w/ 2 Insert-Molded Plastic Pieces, 9 Threaded Standoffs, w/ PSA

Total BOM Cost $137.17

HTC Touch HD2 Mobile Phone Cost AnalysisHTC Touch HD2 Mobile Phone Cost Analysis

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

Country of Origin / Volume Assumptions

Based on markings, the unit was assembled in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in China.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as display module), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

HTC Touch HD2 Mobile Phone - Disassembly View 1HTC Touch HD2 Mobile Phone - Disassembly View 1


Design for Manufacturing / Device Complexity

The HTC Touch HD2 has an overall component count of 1086 (excluding box contents), of which 833 components reside on the Main PCB assembly. Compared to other smartphones we've analyzed in the past, the Legend occupies the upper extremes of the complexity curve (>1000 parts).

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design Notes

Here is a summary of the major components used in the HTC Touch HD2 design:

Main PCB

Baseband

  • Baseband Processor - Qualcomm - QSD8250

Bluetooth / FM / WLAN

  • Bluetooth/FM/WLAN IC - Broadcom - BCM4329EKUBG

Battery / Power Management

  • Power Management IC - Qualcomm - PM7540

Memory

  • Samsung Semiconductor - KBY00U00VM-B450 - 4Gb NAND Flash + 3Gb Mobile SDRAM (Estimated)

RF Transceiver

  • RF Transceiver IC - Qualcomm - RTR6285

User Interface

  • Touchscreen Controller - Atmel - ATmega88V-10MU

Display

  • Display Module - Sharp Microelectronics - LQ043Y1DX01 (4.3' Diagonal, 16.7M Color LCD, 480 x 800 Pixels)

"

HTC Touch HD2 Mobile Phone - Box ContentsHTC Touch HD2 Mobile Phone - Box Contents



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