IHS Insight Perspective
Probably because of poor market penetration these days - Philips produces a product to compete in the $200 USD retail price range - but sells it for $180 USD while offering 'extra features' to distinguish itself. Philips struggles for consumer relevance in this market - and the production volumes reflect this.
Philips Shoqbox SB7200
Key Features/ Comments
• Ruggedized design and water resistant features
• Speakerphone capability
• Comes in 4 colors
• Can be paired with another Philips Shoqbox - where each speaker takes over a different L/R channel offering a power boost in stereo.
• Sold at Apple store
• Ruggedized design with water-resistant, rubber enclosure stands up to harsh, outdoor use for "active lifestyles.
• This enhanced physical performance comes at a price - substantial mechanical BOM with a high parts count.
• Contains additional Cirrus Logic audio DSP
August 2012 Per press
Pricing and Availability
$179.99 USD MSRP
Street prices found as low as suggesting poor channel control.
Assumed to be worldwide availability: available from multiple e-tailers at the time of writing.
30,000 Annual Production Volume
3 Total Years
For the purposes of this teardown analysis, we have assumed an Annual Production Volume of 30000 units and a Product Lifetime Volume of 3 year(s).
Teardown volume and production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
Component pricing reflects, in most cases, the volumes provided. Areas where specific production volumes may have limited effect include smaller passive components.
Total BOM: $46.30
Top Cost Drivers below: $26.43
% of Total BOM 57%
Main Cost Drivers below
Springpower Technology Battery Pack - Li-Ion Polymer, 2-Cell, 7.4V, 1500mAh, 11.1Wh, w/ Charge Protection Circuit & 3-Wire Harness & 3-Position Pin Socket Connector- (Qty: 1)
Sunitec BM150 Bluetooth Module - V3.0, (A2DP)1.2 Support, Contains CSR BC57E687C-GITB-E4 Chipset- (Qty: 1)
Loudspeaker - 6-Ohm, 4W, Full-Range, 26mm Dia. Paper Cone, Kapton Coil Form, 37AWG Copper Voice Coil, 13.5mm Dia. x 4.0mm & 12.5mm Dia. x 2.0mm High Rare Earth Magnets, Steel Pot, Pole Piece & Basket, Rubber Surround, Fabric Mesh Spider, 2 Discrete Insulated Wires & 1 3-Position Pin Socket Connector- (Qty: 2)
Cirrus Logic CS48520-CQZ DSP - Audio Decoder, 32-Bit, Fixed-Point, 19 GPIOs, 300MIPS, 150MHz- (Qty: 1)
Philips EFA01200500200UL AC Adapter - 100-240VAC 50/60Hz Input, 5V/2A Output, NEMA 1-15 Plug to USB Type A- (Qty: 1)
Enclosure, Main, Box Housing Grille - Stamped / Formed Metal, Perforated- (Qty: 1)
ST Microelectronics STA559BW MCU/System-on-Chip - Integrated Digital Audio Processor, Digital Amplifier & FFX Digital Amplifier, 2.1 Channels, Class D, 2x3W- (Qty: 1)
Ceramic Multilayer - X5R/X7R- (Qty: 1)
- (Qty: 168)
Enclosure, Main, Front - Injection Molded Flame Retardant ABS- (Qty: 1)
Not Included in Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
We do provide an Excel tab 'Overall Costs' where a user can enter their known pre and post production costs to build a per unit cost reflective of theirs actual expenditures.
Country of Origin
For the purposes of this analysis, we are assuming the following country(ies) of origin for each level of assembly, based on a combination of 'Made In' markings, and/or assumptions based on our knowledge of such equipment.
Box Contents - China
Main PCB - China
Misc Interface PCB Assemblies - China
Other - Enclosures / Final Assembly - China
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as NFC modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ""Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Component counts by assembly and the number of assembly are indicators of design complexity and efficiency.
Component Qty: 103 - Other - Enclosures / Final Assembly
Component Qty: 426 - Main PCB
Component Qty: 16 - Box Contents
Component Qty: 56 - Misc Interface PCB Assemblies
Component Qty: 601 - Grand Total
This system featured the highest component count and build complexity of all of the systems analyzed - the design features two MCUs, a DSP and significant electronic content when compared to the other systems.
Electronics - This device features two MCUs from ST Micro (one of which has an integrated digital audio processor), and the other is a straight forward 8-bit micro, and a Cirrus Logic DSP at it's core. Bluetooth is implemented through a 3rd party module (Sunitec) based on (again!) the ever present (in the wireless speaker world at least) CSR BlueCore 5 chip (BC57E687xxxx).