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Information Technology

Sony VAIO VPC-EA33FB Notebook Computer Teardown

18 July 2011
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Overview / Main Features

The Sony Viao VPC-EA33 notebook computer under analysis here is a 14 inch laptop featuring Intel Core i3-370M processor and HM55 platform controller system. The Sony laptop comes configured with 4GB of SO-DIMM memory as well as a 500GB hard disk drive. Wireless connectivity supported are 802.11 b/g/n as well as Bluetooth V3.0.

Sony VAIO VPC-EA33FB Notebook Computer Main ImageSony VAIO VPC-EA33FB Notebook Computer Main Image

Target Market

General Consumers

Released

2010

Sony VAIO VPC-EA33FB Notebook Computer - Motherboard TopSony VAIO VPC-EA33FB Notebook Computer - Motherboard Top

Pricing and Availability

Pricing - Based on current Brazilian Real to US Dollar conversion rates, the Sony Viao retails for approximately $1430. Keep in mind that this price reflects the various tariffs that are imposed on electronics goods in Brazil that can be very substantial (i.e. nearly 2x cost of similar products in the US)

Availability - Brazil

Volume Estimations

For the purposes of this teardown analysis, we have applied a lifetime production volume of approximately 1.5M units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

Sony VAIO VPC-EA33FB Notebook Computer - Motherboard BottomSony VAIO VPC-EA33FB Notebook Computer - Motherboard Bottom


Cost Notes

Main Cost Drivers ~85% of Total Materials Cost

Intel - CP80617004119AL - CPU - Intel Core i3-370M Processor, Dual Cores, 2.4GHz, 3MB L3 Cache, 32nm Process, 35W

Samsung - HM500JI/SRS - Hard Drive - 500GB, 2.5', SATA 3Gb/s, 5400RPM, 8MB Buffer

LG Display Co., Ltd. - LP140WH2 - Display Module Value Line Item - 14.0' TFT LCD, 1366 x 768 Pixels, 262K Colors, LED Backlight

Hynix - HMT112S6BFR6C-G7 - SO-DIMM DDR3-1066 - 2GB, 256Mx64, 1.5V, Contain 16 Hynix H5TQ1G83TFR-G7C Memory ICs (Qty:2)

Intel - BD82HM55SLGZS - Platform Controller Hub - HM55 Express Chipset, 65nm

Toshiba Samsung Storage Technology - TS-L633C - CD/DVD RW Drive - 8x, Slim Internal Type, Tray Load, SATA, LightScribe, w/ Double Layer Support

Battery Pack - Li-Ion, 6-Cell, 11.1V, 3500mAh, 39Wh

6-Layer - FR4, Lead-Free, Halogen-Free

Delta Electronics - ADP-65UH - AC Adapter - 19.5V, 3.3A, 65W, w/ 6ft Cord & Velcro Strap

Keyboard Assembly - Injection Molded Plastic Keys, Mounted on Metal Backing Plate, 2 Standoffs, w/ Interconnect Flex

Intel - 112BNHMW - WLAN Half Mini PCIe Module - IEEE802.11b/g/n, Contain Intel JC82544CDE Single-Chip Solution

Suyin - Webcam PCB - Contains VGA Camera Module, & Sonix Technology SN9C233BJG USB2.0 Video Interface Controller

Enclosure, Display, Top - Injection Molded Clear Polycarbonate, Clear Coat, Painted, Printed, w/ 20 Threaded Brass Inserts

Cooler Assembly - Aluminum Fins, Copper Heat Pipe, Stamped Copper Plate, & Stamped / Formed Metal Fan Mount, w/ 2 Mounting Metal Tabs, & Thermal Transfer Material

Enclosure, Main, Top - Injection Molded ABS Polycarbonate, Printed, w/ 33 Threaded Brass Inserts

Foxconn - T77H114.32LF - Bluetooth Module Value Line Item - V3.0, Contain Broadcom BCM2070 Single Chip Solution

Enclosure, Main, Bottom - Injection Molded ABS Polycarbonate, Painted

Synaptics - TM1441 - Touchpad Assembly

Foxconn - CPU Socket - PGA, w/ Lock

Direct Materials + Manufacturing $411.26

Sony VAIO VPC-EA33FB Notebook Computer Cost AnalysisSony VAIO VPC-EA33FB Notebook Computer Cost Analysis

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

Country of Origin / Volume Assumptions

Based on device markings, we've based our analysis with the final assembly in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in China.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as Ethernet connectors), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Design for Manufacturing / Device Complexity

The Sony Viao VPC-EA33 has an overall component count of 1890 (excluding box contents), of which 1319 components reside on the motherboard. In comparison, a HP model in this category typically have overall component count of approximately 1650 parts.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Sony VAIO VPC-EA33FB Notebook Computer - Box ContentsSony VAIO VPC-EA33FB Notebook Computer - Box Contents



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