Acquired Electronics360

Mobile Devices

HTC One (99HTT223-00) Mobile Handset Teardown

25 July 2013
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Summary Points

  • Latest version of the flagship 'One' series from HTC - successor to One X analyzed late 2012
  • HTC One features a redesigned HTC Sense user interface on top of Android
  • Media Content As Differentiator - HTC One brings TV multiplay strategy to smartphone design
  • 185 operators will range the HTC One, including three of the four large US carrier
  • Qualcomm-based design (HTC's standard) - featuring APQ8064AB Quad Core Krait 1.7GHz
  • 4MP BSI primary camera - branded 'UltraPixel' focuses on image quality rather than raw pixels

Target Market

High-end Smartphone

Released

March, 2013

HTC One (99HTT223-00) Mobile Handset Main ImageHTC One (99HTT223-00) Mobile Handset Main Image

Pricing and Availability

$599.99 USD Unsubsidized price thru HTC.com

Worldwide

Volume Estimations

10,000,000 Annual Production Volume
1 Product Lifetime (Years)

For the purposes of this teardown analysis, we have assumed an Annual Production Volume of 10000000 units and a Product Lifetime Volume of 1 year(s).

Teardown volume and production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

HTC One (99HTT223-00) Mobile Handset - Main PCB TopHTC One (99HTT223-00) Mobile Handset - Main PCB Top

Cost Notes

Total BOM: $217.51
Top Cost Drivers below: $146.85
% of Total BOM 68%

Main Cost Drivers below

JAPAN DISPLAY INC - Display Module - 4.7' Diagonal, 16.7M Color TFT, 1920 x 1080 Pixels, 54.1um x 54.1um Pixel Size, 104mm x 58.5mm Viewable Area- (Qty: 1)
QUALCOMM - APQ8064AB - Apps Processor - Quad-Core, 1.7GHz Krait 300, Adreno 320 GPU, 28nm, PoP- (Qty: 1)
SAMSUNG SEMICONDUCTOR INC - KLMBG4GE2A-A001 - Flash - eMMC NAND, 32GB, MLC- (Qty: 1)
QUALCOMM - MDM9215M - Baseband Processor - Multi-Mode, Multi-Band, GSM/EDGE/HSPA+/LTE, 28nm- (Qty: 1)
YOUNG FAST OPTOELECTRONICS - Display Window / Touchscreen Assembly - 4.7' Diagonal, Capacitive, Glass Film Film Type, w/ Corning Gorilla?Glass2 Cover Glass- (Qty: 1)
SK HYNIX INC - H9TKNNNBPDMR - SDRAM - Mobile DDR2, 2GB, PoP- (Qty: 1)
Enclosure, Main, Bottom - Machined Aluminum, Anodized, Printed, w/ Injection Molded Plastic, & 3 Integral Antennas- (Qty: 1)
Primary Camera Module - 4MP, BSI CMOS, 1/3' Format, Auto Focus Lens- (Qty: 1)
QUALCOMM - PM8821 - Power Management IC- (Qty: 1)
PM8018 - (Qty: 1)
PM8921 - (Qty: 1)
UNIMICRON TECHNOLOGY CORPORATION - 8-Layer - FR4/RCF HDI, Any Layer Stacked Via, Lead-Free, Halogen-Free- (Qty: 1)

HTC One (99HTT223-00) Mobile Handset Cost AnalysisHTC One (99HTT223-00) Mobile Handset Cost Analysis

Not Included in Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

We do provide an Excel tab 'Overall Costs' where a user can enter their known pre and post production costs to build a per unit cost reflective of theirs actual expenditures.

Country of Origin

For the purposes of this analysis, we are assuming the following country(ies) of origin for each level of assembly, based on a combination of 'Made In' markings, and/or assumptions based on our knowledge of such equipment.

Box Contents - Taiwan
Camera Assembly - Taiwan
Display / Touchscreen - Taiwan
Main PCB - Taiwan
Misc PCB Assemblies - Taiwan
Other - Enclosures / Final Assembly - Taiwan

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as combo modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

HTC One (99HTT223-00) Mobile Handset - Main PCB BottomHTC One (99HTT223-00) Mobile Handset - Main PCB Bottom

Design Complexity

Component counts by assembly and the number of assembly are indicators of design complexity and efficiency.

Component Qty: 1231 - Main PCB
Component Qty: 2 - Display / Touchscreen
Component Qty: 146 - Other - Enclosures / Final Assembly
Component Qty: 67 - Camera Assembly
Component Qty: 24 - Box Contents
Component Qty: 202 - Misc PCB Assemblies
Component Qty: 1672 - Grand Total

HTC One (99HTT223-00) Mobile Handset - Disassembly View 1HTC One (99HTT223-00) Mobile Handset - Disassembly View 1



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Nov-01 Dec 2017 Helsinki, Finland
23-27 Apr 2018 Oklahoma City, Oklahoma
18-22 Jun 2018 Honolulu, Hawaii
Find Free Electronics Datasheets
Advertisement