Acquired Electronics360

Information Technology

HP xw6600 Workstation Motherboard Teardown

28 October 2011
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Overview / Main Features

Distinct from the standard iSuppli teardown methodology, this analysis approached the bill of materials from a top-down perspective and focused on the components that represented the main cost drivers. Standard pricing analysis was performed on said components and a roll-up estimate was produced for the remaining components which fell below a given threshold. In this analysis, iSuppli has itemized and examined all integrated circuits (down to 8-pin ICs) in addition to other noteworthy cost drivers. All other components are catagorized as a single line item.

iSuppli estimates for rest-of-BOM costs where derived from other motherboard teardowns and are an accurate, albeit high-level, facsimile of total costs for the rest of the BOM.

Target Market

Not Applicable - Captive Motherboard in HP Workstations

HP xw6600 Workstation Motherboard Main ImageHP xw6600 Workstation Motherboard Main Image

Released

Unknown

Pricing and Availability

Pricing - Not Applicable for this Analysis

Availability - Not Applicable for this Analysis

Volume Estimations

For the purposes of this teardown analysis, iSuppli assumed a lifetime production volume of 250For the purposes of this teardown analysis\, iSuppli assumed a lifetime production volume of 250,000 units.

As a reminder\, teardown volume production assumptions are primarily used for iSuppli cost analysis in terms of amortized non-recurring engineering (NRE) and tooling costs\, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed and specified otherwise\, volumes are different by an order of magnitude\, minor changes in volume (for example\, 1 million versus 2 million) rarely have a large net effect on the final analysis.

Cost Notes

Two of the major cost drivers in this analysis are the Northbridge and Southbridge chipsets from Intel. With desktop consumer products\, iSuppli estimates Intel to make very thin margins on these chipsets; for this analysis these margins where adjusted (up) to account for the higher-performance\, lower-volume professional market for servers and workstations.

Main Cost Drivers Representing Nearly 95% of Total Materials Cost

  • NU5400BSLARE - Intel - Northbridge - Memory Controller Hub
  • Rest of Bill Of Materials Estimate
  • QG6311SL97N - Intel - Southbridge - I/O Controller Hub
  • Tripod (Wuxi) Electronics - 8-Layer - FR4
  • Cooler Assembly - Copper Plate / Tube w/ 45 Aluminum Fin Plates and 80x15mm Fan & Fan Grille
  • 47213xxxx - Molex - CPU Socket - LGA771\, w/ Shepherd Hook Lever (Qty:2)
  • BCM5755KFBG - Broadcom - Ethernet Controller - 10/100/1000BASE-T
  • ISL6313CRZ - Intersil - PWM Controller - Two-Phase\, Buck\, w/ Integrated MOSFET Drivers
  • ISL6310CRZ - Intersil - (Qty:2)
  • EFB0412HD - Delta Electronics - Fan - DC Brushless\, 12VDC\, 0.12A\, 40mm x 40mm x 2mm\, Injection Molded Plastic Housing\, w/ Integral 4-Wire Harness and 4-Position Pin Socket Connector
  • Heatsink - Extruded / Machined Aluminum\, Black Anodized\, w/ Metal Mounting Clip & Thermal Transfer Material (Qty:2)

Materials and Manufacturing - $178.82

What Is Not Included in the Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect only the direct materials cost (from component vendors and assorted EMS providers) and manufacturing with basic testing. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property\, royalties and licensing fees (those not already included into the per component price)\, software\, software loading and testing\, shipping\, logistics marketing and other channel costs including not only EMS provider and OEM margins\, but that of other resellers. The cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

OEM/ODM/EMS Relationships / Manufacturing

Per the iSuppli Global OEM Manufacturing and Design Analysis (GOMDA)\, HP outsources its product lines to a variety of EMS and ODMs\, including: Inventec\, Flextronics\, Wiston\, and Celestica.

Country of Origin / Volume Assumptions

There were no country-of-origin markings at a motherboard system level - however based on iSuppli experience with other HP products\, the assumption is that the motherboard was assembled in China.

Country-of-origin assumptions relate directly to the associated cost of manufacturing\, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as hard drives)\, iSuppli deoes not calculate internal manufacturing costs\, but rather assess the market price of the finished product in which case country-of-origin assumptions may or may not have a direct effect on pricing.

Labor rates are applied directly only to hand-inserted components and systems in the analysis\, and although regional assumptions do\, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. Auto-inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Design for Manufacturing / Device Complexity

Total component count was not established exhaustively for this high-level analysis.

Component counts have a direct bearing on the overall manufacturing cycle times and costs\, and also can increase or decrease overall yields and re-work. iSuppli calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also decreased in this case because of assumed labor rate applied for China.

Note that manual labor has a much smaller effect on auto-insertion assembly lines\, where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design Notes

Summary of the major components used in the HP xw6600 motherboard design:

Northbridge

Northbridge - Memory Controller Hub - NU5400BSLARE - Intel

Southbridge

I/O Controller Hub - QG6311SL97N - Intel

Other ICs

Ethernet Controller - 10/100/1000BASE-T - BCM5755KFBG - Broadcom



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement

CALENDAR OF EVENTS

Date Event Location
30 Nov-01 Dec 2017 Helsinki, Finland
23-27 Apr 2018 Oklahoma City, Oklahoma
18-22 Jun 2018 Honolulu, Hawaii
Find Free Electronics Datasheets
Advertisement