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Information Technology

SuperMicro X8DTi-F Server Motherboard Teardown

01 February 2010
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Overview / Main Features

The SuperMicro X8DTi-F is dual Intel Xeon processor (5500 series) server motherboard with an Intel 5520 chipset, integrated gigabit Ethernet and provisions for server management. The motherboard under analysis does not come equipped with CPU nor memory modules.

SuperMicro X8DTi-F Server Motherboard Main ImageSuperMicro X8DTi-F Server Motherboard Main Image

Target Market

Enterprise users

Released

unknown

SuperMicro X8DTi-F Server Motherboard - Motherboard TopSuperMicro X8DTi-F Server Motherboard - Motherboard Top

Pricing and Availability

Pricing - Retail pricing for the bare motherboard is approximately $400

Availability - Assumed to have global availability.

Volume Estimations

For the purposes of this teardown analysis, we have assumed a lifetime production volume of 200K units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

SuperMicro X8DTi-F Server Motherboard Cost AnalysisSuperMicro X8DTi-F Server Motherboard Cost Analysis

Cost Notes

Major Cost Drivers (Representing ~65% of Total Direct Materials Costs)

Intel - AC5520SLGMU - Northbridge - I/O Hub

Boardtek Electronics - 8-Layer - FR4, Lead-Free

Intel - JL82576EB - Ethernet Controller - Dual Port, 10BASE-T/100BASE-TX/1000BASE-T

Intel - AF82801JIR - Southbridge - I/O Controller Hub (ICH10)

Nuvoton - WPCM450RA0BX - Baseboard Management Controller

Foxconn - CPU Socket - LGA1366, w/ Lock & Dummy Insert

Foxconn - CPU Socket - LGA1366, w/ Lock & Dummy Insert

Hynix - HY5PS1G1631CFP-Y5 - SDRAM - DDR2, 1Gb (64M x 16), 1.8V

Intersil - ISL6612CRZ - MOSFET Driver - Synchronous Rectified Buck (Qty:6)

Intersil - ISL6612CRZ - MOSFET Driver - Synchronous Rectified Buck (Qty:6)

Infineon - BSC020N03LS G - MOSFET - N-Channel, 30V, 100A (Qty:6)

Infineon - BSC020N03LS G - MOSFET - N-Channel, 30V, 100A (Qty:6)

Infineon - BSC020N03LS G - MOSFET - N-Channel, 30V, 100A (Qty:5)

Nuvoton - W83627HG-AW - I/O Controller - Super I/O Device, LPC Interface

Macronix - MX25L12805DMI-20G - Flash - 128Mb, Serial, 50MHz, 2.7V

Direct Materials Only $167.42

Total BOM Cost $177.66

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

Country of Origin / Volume Assumptions

Based on markings, it is assumed the unit was assembled in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in China.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as DIMM modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pin count of the device. This calculation is affected by country or region of origin as well.

Design for Manufacturing / Device Complexity

The SuperMicro X8DTi-F server motherboard has a component count of 3318 (96 of which are mechanical in nature). Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design Notes

Here is a summary of the major subsystems and components in the SuperMicro X8DTi-F server motherboard design:

Chipset

  • Northbridge - Intel - AC5520SLGMU
  • Southbridge - Intel - AF82801JIR

I/O & Interface

  • Ethernet Controller - Intel - JL82576EB
  • Baseboard Management Controller - Nuvoton - WPCM450RA0BX
  • I/O Controller - Nuvoton - W83627HG-AW


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