Overview / Main Features
The Hon Hai J9C-GOBI2000 is an embedded WWAN module (in PCIe Mini card format) featuring Qualcomm's Gobi 2000 chipset which supports both HSPA and EVDO data protocols for a truly global compatibility. The embedded WWAN module supports quad-band UMTS/GSM as well as dual-band CDMA cellular networks along with GPS functionalities. Central to the design of the J9C-GOBI2000 is the Qualcomm MDM2000 baseband. Other Qualcomm solutions include the RTR6285 RF transceivers, RFR6500 RF receiver and PM6653 power management ICs. Mobile DDR memory is provided by a Samsung SDRAM with 256Mb.
Mobile Device OEMs / Wireless Broadband Service Providers
Pricing - Unknown, typically embedded WWAN modules do not have published pricing as they are sold (through contracts to OEMs and service providers)
Availability - Assumed global
For the purposes of this teardown analysis, we have applied a lifetime production volume of approximately 4M units.
As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
Main Cost Drivers ~85% of Total Materials Cost
Qualcomm - MDM2000 - Baseband Processor - Quad-Band GSM/EDGE, Quad-Band UMTS, HSUPA 5.76Mbps, CDMA2000 1xEV-DO 800/1900
Qualcomm - RTR6285 - RF Transceiver - ZIF, Quad-Band GSM/EDGE, Tri-Band UMTS Transceiver, HSDPA, w/ Integrated GPS Receiver & Receive Diversity
Samsung Semiconductor - K4X56323PI-8GC6 - SDRAM - Mobile DDR, 256Mb (8Mx32), 1.8V
Qualcomm - RFR6500 - RF Receiver - ZIF, Dual-Band CDMA2000 1X/CDMA2000 1X EV-DO, WCDMA/HSPA, GPS, SiGe BiCMOS
Qualcomm - PM6653 - Power Management IC - w/ Integrated USB Transceiver
Wus Printed Circuit Co. - 10-Layer - FR4/RCF HDI, 2+6+2, Lead-Free
TriQuint Semiconductor - TQM7M5012 - PAM - Quad-Band GSM/EDGE
Anadigics - AWT6221RM28 - PAM - Dual-Band WCDMA/HSPA 850/1900
Anadigics - AWT6224RM28 - PAM - Dual-Band WCDMA/HSDPA 900/2100
Numonyx - M58WR032KL70ZA6U - Flash - NOR, 32Mb (2Mb X 16), 1.8V, 70ns
Murata - MQL Series - VCO
Kyocera - KT2520 Series - TCXO - 19.200MHz
Murata - Antenna Switch
Avago Technologies - ACMD-7403-TR1 - Duplexer - WCDMA 1900
Direct Materials + Manufacturing $34.55
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
Hon Hai is a vertically integrated OEM and EMS provider with manufacturing facilities throughout mainland China.
Country of Origin / Volume Assumptions
Based on markings, the unit was likely assembled in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in China.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as SMT covers), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Design for Manufacturing / Device Complexity
The Hon Hai J9C-GOBI2000 embedded WWAN module has an overall component count of 327.
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
Here is a summary of the major components used in the Hon Hai J9C-GOBI2000 WWAN Module design:
- Baseband Processor - Qualcomm - MDM2000
- Power Management IC - Qualcomm - PM6653
- SDRAM - Samsung Semiconductor - K4X56323PI-8GC6, Mobile DDR, 256Mb (8Mx32), 1.8V
RF / PA
- RF Transceiver - Qualcomm - RTR6285
- RF Receiver - Qualcomm - RFR6500