Overview / Main Features
Samsung announced their first wireless tablet device, the Galaxy Tab GT-P1000 at IFA, which garnered much publicity as the first true Apple iPad competitor. The 7-Inch tablet features a custom Android 2.2 (Froyo) build supporting an unheard of Android screen resolution of 1024 x 600. As a flagship mobile device within Samsung's Galaxy line of products, the Galaxy Tab is actually a functional mobile handset as well as tablet computing device running 3G (UMTS/HSPA) in 3 frequency bands. According to Samsung's micro-site for the Galaxy Tab, the 7-Inch tablet users can download applications from Samsung's home-grown Apps Store as well as digital media from Samsung "Hub service. The Galaxy Tab distinguishes itself from the iPad by having built in Flash support (for a more universal web browsing experience) and gyro sensors (presumably for gaming purposes). Also, the Tab comes with a primary 3MP autofocus camera along with a 1.3MP front facing or video conferencing camera (a feature that the Apple iPad has yet to offer).
From a design perspective, however, the Samsung Galaxy Tab is more a scaled up smartphone than a full-size tablet device like the iPad. Inside, we find that the Tab has nearly the identical components as we have seen on the Galaxy S smartphone. Again, we see a similarly complex MCP with 8Gb MLC Flex-OneNAND + 4Gb Mobile DDR + 1Gb OneDRAM, PoP (Estimated) along with the Samsung ""Hummingbird' apps processor. Just as we found on the Galaxy S, the Tab uses the Infineon PMB9801 baseband running a tri-band 3G radio.
Additions to the Galaxy Tab design is a 3-axis gyro from ST Microelectronics which is very similar to the one found on the iPhone 4 as well as a custom display driver IC from Samsung to drive the high resolution display (likely a hardware solution to overcome the Android 2.2 screen resolution limitations).
Wireless Tablet Segment (Apple iPad 3G competitor)
Pricing and Availability
Pricing - An unsubsidized version of the Samsung Galaxy Tab is retails for 699 Euros or approximately $1000 USD.
Availability - Currently limited to Europe, however, to be soon available globally
For the purposes of this teardown analysis, we have applied a lifetime production volume of approximately 4M units.
As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
Main Cost Drivers ~80% of Total Materials Cost
Samsung Mobile Display - LMS700JF03 - Display Module - 7' Diagonal, LED Backlit TFT, 1024 x 600 Pixels, 169ppi, 24 White LEDs Backlight
Display Window / Touchscreen - 7' Diagonal, Capacitive, Painted, Printed
SanDisk - SDIN4C2-16G - Flash - eMMC NAND, 16GB, MLC
Samsung Semiconductor - KB100D00YM-A453 - MCP - 8Gb MLC Flex-OneNAND + 4Gb Mobile DDR + 1Gb OneDRAM, PoP (Estimated)
Samsung SDI - SP4960C3A - Battery - Li-Ion, 3.7V, 4000mAh, 14.8Wh
Samsung Electro-Mechanics - 8-Layer - FR4/RCF HDI, 2+4+2, Lead-Free, Halogen-Free
Infineon - PMB9801 - Baseband - HSUPA/HSDPA/WCDMA/EDGE, ARM1176 Core, 65nm
Samsung Semiconductor - S5PC110A01 - Application Processor - 1GHz, ARM Cortex A8 Core, 45nm, PoP
Primary Camera Module Value Line Item - 3.0MP CMOS, 1/4' Format, Auto Focus Lens
Broadcom - BCM4329HKUBG - Bluetooth/FM/WLAN - Single Chip, WLAN IEEE802.11a/b/g/n, Bluetooth V2.1+EDR, w/ FM Radio Receiver & Transmitter
Charger - 5V, 2A
Secondary Camera Module Value Line Item - 1.3MP CMOS, 1/6' Format, Fixed Lens
ST Microelectronics - L3G4200D - Gyroscope - 3-Axis, Digital
Infineon - PMB5703 - RF Transceiver - Quad-Band GSM/EDGE, Quad-Band WCDMA/HSDPA/HSUPA, 130nm RF CMOS
Enclosure, Main, Rear - Injection Molded Polycarbonate, ESD/EMI Coating, Clear Coat, Printed
Atmel - MXT224 - Touchscreen Controller - Capacitive, 12-bit, 224-Channel Configuration, 400KHz, w/ I2C Interface
Direct Materials + Manufacturing $261.99
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself ?cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
Samsung's manufacturing profile is one that is pre-dominantly in-house and that is especially true for flagship devices such as this Galaxy Tab.
Country of Origin / Volume Assumptions
Based on markings, the unit was likely assembled in Korea. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in Korea.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished?sub-assemblies (such as TFT display), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ""Auto?inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Design for Manufacturing / Device Complexity
The Samsung Galaxy Tab has an overall component count of 910 (excluding box contents), of which 778 reside on the main PCB. This level of complexity is what we expected to see in high end smartphones. In comparison, the Samsung Galaxy S came in at a complexity level of 856 components whereas Apple iPad 3G was over 1600 parts.
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for Korea.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
Here is a summary of the major components used in the Samsung Galaxy Tab design:
- Samsung Mobile Display - LMS700JF03 - Display Module - 7' Diagonal, LED Backlit TFT, 1024 x 600 Pixels, 169ppi, 24 White LEDs Backlight
Apps Processing / Memory
- Application Processor - Samsung Semiconductor - S5PC110A01, ARM Cortex A8 Core
- MCP - Samsung Semiconductor - KB100D00YM-A453, 8Gb MLC Flex-OneNAND + 4Gb Mobile DDR + 1Gb OneDRAM, PoP (Estimated)
- Flash - SanDisk - IN4C2-16G, MC NAND, 16GB, MLC
- Baseband IC ?Infineon - PMB9801, HSUPA/HSDPA/WCDMA/EDGE
BT / FM / GPS / WLAN
- Bluetooth/FM/WLAN IC - Broadcom - BCM4329HKUBG
- GPS Receiver - Broadcom - BCM4751IUB2G
RF / PA
- Transceiver - Infineon - PMB5703 RF
- Display Driver - Samsung Semiconductor - S4DJ018X01
- Audio Codec - Wolfson Microelectronics - WM8994ECS/R
- LVDS Transmitter - Texas Instruments - SN75LVDS83BZQLR
- HD Video Interface IC - Silicon Image - SiI92348T
- Touchscreen Controller - Atmel - MXT224
- Power Management IC - Maxim - MAX8998