Acquired Electronics360

Wireless Connectivity

Ericsson F3307 Embedded WWAN Module Teardown

08 December 2010
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Overview / Main Features

The Ericsson F3307 is an embedded WWAN module (in PCIe Mini card format) designed for use in low power mobile devices such as tablets and netbooks. The dual band UMTS /quad band GSM wireless broadband module supports both HSPA and GPRS/EDGE data standards. Internally, the F3307 features a ST-Ericsson DB3430 baseband processor, dual ST-Ericsson RF3300 RF Transceiver (for receive diversity) and Dialog D1893A analog baseband and power management design. Memory is provided by a Micron multi-chip package featuring 1Gb NAND Flash and 256Mb Mobile SDRAM.

Ericsson F3307 Embedded WWAN Module Main ImageEricsson F3307 Embedded WWAN Module Main Image

Target Market

Mobile Device OEMs / Wireless Broadband Service Providers

Released

Based on publication dates on product specification documents, released in 2010

Ericsson F3307 Embedded WWAN Module - PCB TopEricsson F3307 Embedded WWAN Module - PCB Top

Pricing and Availability

Pricing - Unknown, typically embedded WWAN modules do not have published pricing as they are sold (through contracts to OEMs and service providers)

Availability - Assumed global

Volume Estimations

For the purposes of this teardown analysis, we have applied a lifetime production volume of approximately 4M units.

As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

Ericsson F3307 Embedded WWAN Module Cost AnalysisEricsson F3307 Embedded WWAN Module Cost Analysis

Cost Notes

Main Cost Drivers ~80% of Total Materials Cost

ST-Ericsson - DB3430 - DBB - Digital Baseband Processor

ST-Ericsson - RF3300 - RF Transceiver - Quad-Band GSM/EDGE & Flexible Quad-Band WCDMA/HSDPA (Qty:2)

Micron Technology - MT29C1G56MAUZAJC-75 IT - MCP - 1Gb NAND Flash + 256Mb Mobile SDRAM

Multek Hong Kong - 8-Layer - FR4/RCF HDI, 3+2+3, Lead-Free, Halogen-Free

Skyworks - SKY77549-E6 - Transmit Module - PAM, Quad-Band GSM/EDGE, w/ Integrated Antenna Switch

Dialog Semiconductor - D1893A - ABB - Analog Baseband / Power Management

RF Micro Devices - PAM - WCDMA/HSDPA 2100

Skyworks - SKY77181-1 - PAM - WCDMA/HSDPA 900

ST-Ericsson - ISP1509AET - USB On-the-Go Transceiver - USB2.0, ULPI, Up to 480 Mbit/s

National semiconductor - LM3209 - Regulator - DC-DC Converter

RF Switch (Qty:2)

Direct Materials + Manufacturing $25.83

What Is Not Included in our Cost Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

Manufacturing Notes

The device under analysis is labeled as a prototype made in Sweden. We do not expect the production version of the embedded WWAN module to be manufactured at Sweden however, for the purpose of this analysis, we are using the country of origin as identified on the hardware we have at hand.

Country of Origin / Volume Assumptions

Based on markings, the unit was likely assembled in Sweden. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were also sourced in Sweden.

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as SMT covers), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Design for Manufacturing / Device Complexity

The Ericsson F3307 WWAN module has an overall component count of 275. In comparison, a previously analyzed Ericsson F3507g (tri-band UMTS/quad-band GSM) had a complexity of 482 parts.

Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for Sweden.

Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.

Design Notes

Here is a summary of the major components used in the Ericsson F3307 WWAN Module design:

Main PCB

Baseband

  • DBB - Digital Baseband Processor - ST-Ericsson - DB3430

Memory

  • MCP - Micron Technology - MT29C1G56MAUZAJC-75 IT, 1Gb NAND Flash + 256Mb Mobile SDRAM

Baseband / Power Management

  • ABB - Analog Baseband / Power Management - Dialog Semiconductor - D1893A

RF / PA

  • RF Transceiver - ST-Ericsson - RF3300
  • Transmit Module - Skyworks - SKY77549-E6

User Interface

  • USB On-the-Go Transceiver - ST-Ericsson - ISP1509AET

"

Ericsson F3307 Embedded WWAN Module - PCB BottomEricsson F3307 Embedded WWAN Module - PCB Bottom



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