Main Features / Overview
Part of Sony's "Cyber-shot line of digital 'point and shoot' cameras, the Cyber-shot DSC-T200 is, at the time of writing, Sony's high-end within the 'ultra-slim' segment of the Cyber-shot series (in North America at least!).
The Sony Cyber-shot DSC-T200 is an 8 megapixel point-and-shoot consumer camera with image stabilization, 5x zoom lens, and a 3.5 inch rear display. The camera takes SD/SDHC and multimedia card memory cards, and takes a factory Li-Ion battery pack (3.6V, 670mAh). Note one very interesting feature later in our deisgn notes - this camera features a 'battery authentication device'!
Unlike competing Canon cameras (such as the IXY 910 IS / SD 870 IS), this Sony model features HD television output, and allows users to play slideshows from the camera using musical accompaniment, either using pre-loaded music, or user downloadable music - making this Sony model an attractive consumer feature for some.
The Cyber-shot DSC-T200 also features other software features such as face recognition and even smile detection (not found in the Canons, despite face recognition). For a complete list of features, see the features section in the online teardown analysis.
Aug, 2007 per Sony press release. Part of T-series general release at this time.
Pricing and Availability
Retail price from Sony, on their SonyStyle.com website: $399.99. However it is possible, at the time of writing (Dec 2007) to find several e-tailers offering this model for just around or uner $300 USD.
For the purposes of this teardown, we estimate unit shipments for the Cyber-Shot DSC-T200 over the course of a 2 year production lifetime would be on an order of magnitude of 3M units.
As a reminder, volume production assumptions are not meant to be necessarily 'market accurate', but are meant primarily to be used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially).
Function / Performance
Detailed testing was not performed on the DSC-T200.
iSuppli's standard costing methodologies were applied to all of the camera components. The optics assemblies (with zoom mechanisms and motors) and viewfinder (where applicable), were treated as single 'sub-assemblies' from a cost point of view in the main bill of materials.
We have, however, also provided a breakout of the lens assembly cost assumptions in the ""Optics Summaries" tab in the BOM spreadsheet. Please refer to this tab for details on the lens and viewfinder costs.
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
Country of Origin / EMS provider
This product was labeled Made in Japan. Given the competitive nature of the consumer camera market, however, it is assumed that the manufacturer makes use of lower cost regions (China, specifically) where possible to reduce overall costs, and that only 'final assembly', and the optics assemblies (specifically) were performed in Japan. Therefore, we have assumed that the manufacturer is leveraging lower cost in China for PCB population, and custom mechanicals (plastics and metals) etc.
This assumption has a strong impact on the manufacturing cost calculations, given the very high cost of labor in Japan.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as Bluetooth modules or camera modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ""Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Design for Manufacturing / Device Complexity
Cameras are always complex, from our perspective, not so much from the point of view of electronics, but rather more in the physical / mechanical implementation, and therefore feature a lot of small, precision mechanical assemblies which are more involved at the hand assembly level, rather than surface mount production level. In order to create a simple metrics against which we can compare similar devices, we typically turn to component counts to gage this relative complexity.
The Sony Cyber-shot DSC-T200 features a total of 596 components (not including optical assemblies or box contents), of which 109 are mechanical in nature.
The number of mechanical components usually is a direct driver of hand-assembly costs, whereas the electronic component count (and I/O count, density, etc.) are relative metrics for the more automated portion (namely SMT assembly) of manufacturing costs.
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
Hardware analysis typically reveals a direct link between functionality of the device, the number and type of discrete components, and the cost of those functions. This device is no exception, and features quite a bit of discrete silicon to manage the various features and functions of the Sony DSC-T200. The core of the design revolves around a Sony ""Bionz" Image Processor (CXD4208GG), which features a Package-on-Package memory solution (in which supporting memory chips are mounted directly on top of the processor). This is increasingly popular in the applications and image processor arena for mobile devices.
Package on package provides the dual benefits of being both space-saving (in high-density applications), and can also provide the benefit of improved electrical performance (lower latency) between memory and processor at high frequencies.
The DSC-T200 also features a Renesas optical image stabilizer chip (R2J30500), and a Texas Instruments CCD signal processor and Sony CCD imager / buffer amp on the analog front end interfacing with the image sensor.
The power management slot features a Freescale solution (all Canons analyzed featured Fujitsu 'standard' solutions) which appears to be a custom ASIC solution, but also, and this is a first time sighting: an NEC 'battery authentication' chip. Bad news for knockoff batteries usage! This could become a trend as OEMs attempt to control this area more for spare parts.
Sanyo provides the motor driver, with Panasonic covering the I/O & Interface section with their solution for audio/video processing, and there is also a minor Sony angular sensor amplifier chip which amplifies the signals from the Murata single-axis angular velocity sensors (ENC-03R). These devices (also found in the PS3 wireless controller) provide orientation sensing.
Image Processing / Memory
- Image Processor - Sony - CXD4208GG - ""Bionz" - PoP (Package on Package)
- MCP - Samsung Semiconductor - K5W1213ACB-DK75 - 512Mb OneNAND Flash + 512Mb Mobile SDRAM, PoP
- Renesas - R2J30500 - Optical Image Stabilization Device
Image Sensor / Analog Front End
- Texas Instruments - VSP2700 - CCD Signal Processor
- Sony - CXA3741U - CCD Imager / Buffer Amp
- Freescale - SC901572 - ASIC - Power Management Device
- NEC - uPD79F0043FC-402 - ASIC - Battery Authentication Device
- Sanyo - LV8053 - Motor Driver - For Digital Camera (Content Based on LV8054LP)
I/O & Interface
- Panasonic - AN12918A - Audio Interface & Video Driver
- Sony - CXA3739A - Angular Sensor Amplifier / Processor
- 3.5' Diagonal, 230K Pixels (Delta Pixel Structure), Clear Photo LCD Plus TFT
- Sony - ICX636EQP - 8.15MP, CCD, 1/2.5' Format - Diagonal 7.183mm, 1.75um x 1.75um Pixel Size, 5.83mm x 4.35mm Active Image Area
- See optics summaries tab in Excel spreadsheet analysis for detailed breakouts