Main Features / Overview
The HTC Tilt (8925 also known as TyTN II) is a quad-band GSM, tri-band UMTS 'slider' handset in which the screen slides off to the side (rather than straight up) which exposes a full QWERTY keyboard, which then transitions the phone from 'vertical' format PDA, to a sort-of sideways oriented mini mobile PC format. To further this image, the screen tilts upwards towards the user when in 'sideways' mode, which allows a user to place the device on a surface and use it somewhat like a small notebook computer.
The Tilt is somewhat similar to the recently analyzed LG KS20 (the successor to the LG Prada) and features the same basic chipset and architecture as the KS20 - based on Qualcomm's latest and greatest MSM7200 chipset which gives it the highest data rate possible on the market right now (HSDPA 7.2Mbps downlink, and HSUPA (w/ uplink speeds of 5.76Mbps. The raw speed of this device puts it at the top of the list with respect to data rates.
In addition the HTC 8925 offers GPS (using integrated Qualcomm chipset functionality and Telenav 5.2), Bluetooth V2.0 EDR, WiFi (802.11 b/g), and a 3 megapixel camera to boot. Basically, the HTC 8925 comes with a full contingent of all of the most updated features making it a very strong competitor within the AT&T handset portfolio against products like the iPhone. It's main weakness vi-a-vis the latter being software, and the different more conventional touchscreen interface.
Early tech adopters / high-end mainstream consumers.
Per AT&T Press release, the "Tilt version of the 8925 was announced October 4, 2007 for release Oct 5.
Per press release: ""The AT&T Tilt will be available for a promotional price as low as $299.99** beginning Oct. 5 at AT&T retail stores nationwide."
For the purposes of this teardown, we estimate unit shipments for the HTC Tilt over the course of a 2-year production lifetime would be on an order of magnitude around 1.3 million units.
As a reminder, volume production assumptions are not meant to be necessarily 'market accurate', but are meant primarily to be used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially).
ISuppli's Design Forecast Tool (DFT) and Market Shares
As part of iSuppli's Design Forecast Tool (DFT), we forecast handset shipments by major design feature and manufacture, as well as the number of design starts a manufacturer will have by feature set.
From our Design Forecast Tool (DFT), we estimate a total of 149 million units of WCDMA handsets in the 2007 global market; and further that there will be shipments of 62 million units of 3 megapixel-enabled camera phones in the 2007 global market.
Function / Performance
No testing was performed on this unit.
HTC 8925 (Tilt) Mobile Phone Cost Analysis
Main Cost Drivers Representing ~46% of total materials cost
Qualcomm - MSM7200 - Baseband Processor - Single Chip, Quad-Band GSM/GPRS/EDGE, HSDPA 7.2Mbps, HSUPA 5.76Mbps, Integrated 400MHz ARM11 Applications Processor & 274MHz ARM9 uProcessor - (Qty:1)
Toppoly - TD028TTEB3 - Display Module Value Line Item - 2.8' Diagonal, 65K Color TFT, 240 x 320 Pixels - (Qty:1)
Camera Module - 3.0MP/CMOS/Autofocus - (Qty:1)
Samsung Semiconductor - KAL009001M-D1YY - MCP - 2Gb NAND Flash, 1Gb Mobile SDRAM - (Qty:1)
UniMicron Technology - - 8-Layer - FR4/RCF HDI, 2+4+2 - (Qty:1)
Texas Instruments - WL1251 - WLAN Baseband - Single-Chip, 802.11b/g, Wilink 4.0, 90nm - (Qty:1)
DynaPack - KAIS160 - Battery - Li-Ion, 3.7V, 1350mAh - (Qty:1)
Main PCB - 5-Layer - FR4/Flex Kapton Hybrid Composite Laminate - (Qty:1)
Qualcomm - RTR6275 - RF Transceiver - ZIF, Quad-Band GSM/GPRS Transceiver, Tri-Band UMTS 850/1900/2100MHz Transmitter, Single Band UMTS Receiver - (Qty:1)
Xilinx - XC2C128-7CP132C - CPLD - CoolRunner-II, 128 Macrocells, 100 I/Os, 0.18um - (Qty:1)
Samsung Semiconductor - S3CA460SL - LCD Display Controller - MDDI-Enabled, Integrated Dual Controller, w/ Internal Frame Buffer - (Qty:1)
Qualcomm - RFR6500 - RF Receiver - ZIF, Dual-Band WCDMA 850/1900MHz, GPS - (Qty:1)
Black Painted, Silkscreened, ESD/EMI Coating, w/ 5 Threaded Metal Inserts - (Qty:1)
Qualcomm - PM7500 - Power Management IC - (Qty:1)
Texas Instruments - BRF6300C - Bluetooth - Single Chip Solution, V2.0 + Enhanced Data Rate - (Qty:1)
Anadigics - AWT6280RM11P8 - PAM - Quad-Band GSM/GPRS/EDGE, w/ Integrated Power Control - (Qty:1)
LED - High Intensity White - (Qty:12)
Materials & Manufacturing $173.08
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
HTC Relationships / Manufacturing
HTC is an important ODM partner offering smartphones and PDAs to a number of international service providers, including Vodafone. Vodafone is in fact one of HTC's top customers. We believe that HTC are producing most of their phones in house. In fact, iSuppli globally sees that about 80% of handsets (all manufacturers mixed) in 2006 were produced 'in-house' by handset OEMs or ODMs, with a growing percentage of EMS-produced devices. HTC, as a Taiwanese company is assumed in our teardown analysis to produce, when possible, and where noted on the labels in mainland China, and sometimes in Taiwan.
Country of Origin / EMS provider
This product was labeled with Taiwan as the country of origin, however we typically assume that HTC is leveraging lower cost regions (China) for much of the sub-assemblies such as PCBA assembly, and that only final integration is taking place in Taiwan.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as Bluetooth modules or camera modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. ""Auto" inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Design for Manufacturing / Device Complexity
PDA phones typically are usually electronically more complex, as are any devices which have moving mechanisms (sliders, or hinged flip phones, etc.), as in both cases these design choices inherently add complexity and therefore component counts and cycle times in manufacturing, etc.
Overall, the HTC 8925 has a total component count of 1452 components, of which 228 are mechanical in nature. HTC PDA devices are frequently some of the most component dense designs and always seem to push the envelope of complexity at the highest end of the spectrum. This component count is similar to a laptop computer, for example.
The number of mechanical components usually is a direct driver of hand-assembly costs, whereas the electronic component count (and I/O count, density, etc.) are relative metrics for the more automated portion (namely SMT assembly) of manufacturing costs.
Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design. The cost of manufacturing is also, to some extent, decreased in this case because of assumed labor rate applied for China.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
We have seen the recent rapid evolution from EDGE handsets to HSDPA 1.8, then 3.6 and now 7.2Mbps link speeds with HSUPA 5.76Mbps uplink speeds. During this rapid evolution in handsets torndown over a period of less than two years - all of the chipsets we have seen have been the same ones over and over - from Qualcomm. Those chipsets all revolve around the MSM6275 (1.8Mbps), MSM6280 (3.6Mbps upgradable to 7.2Mbps), and now this MSM7200 (7.2Mbps with HSUPA). We have yet to see a competing solution in the HSDPA space - though we are aware of their existence, it appears that Qualcomm have a very strong position in this segment.
Also, this design is one of few we have seen that actually implement Qualcomm's 'resident' GPS solution.
The other big silicon 'winner' in this design is Texas Instruments (TI) who have the slots for Bluetooth and WiFi locked up in this design.
The 3 megapixel camera is one of few (but increasingly popular) auto-focus devices we have analyzed to date. It is logical that as camera modules improve in resolution that the optics should improve, but interestingly over the last 2 to 3 years - we have only seen a handful of auto-focus modules with most featuring simple fixed lens kits (most modules being fixed focus with conventional lens kit (3 lens polycarbonate more often than not) and packaging. Despite the improvements in resolution, optics have remained, from our perspective, mostly unevolved.
Here is a summary of the major components used in the HTC 8925 (Tilt) design:
- Baseband - Qualcomm - MSM7200 - Single Chip, Quad-Band GSM/GPRS/EDGE, HSDPA 7.2Mbps, HSUPA 5.76Mbps, Integrated 400MHz ARM11 Applications Processor & 274MHz ARM9 uProcessor
- CPLD - Xilinx - XC2C128-7CP132C - CoolRunner-II, 128 Macrocells, 100 I/Os, 0.18um
Battery / Power Management
- Power Management IC - Qualcomm - PM7500
- MCP - Samsung Semiconductor - KAL009001M-D1YY - 2Gb NAND Flash, 1Gb Mobile SDRAM
- RF Transceiver - Qualcomm - RTR6275 - ZIF, Quad-Band GSM/GPRS/EDGE Transceiver and Tri-Band WCDMA 850/1900/2100MHz Transmitter and Single-Band UMTS 1900 or 2100 Receiver
- RF Receiver - ZIF - Qualcomm - RFR6500 - Dual-Band WCDMA 850/1900MHz, GPS
- Anadigics - AWT6280RM11P8 - Quad-Band GSM/GPRS/EDGE, w/ Integrated Power Control
- Anadigics - AWT6279RM20P8 - 1920MHz - 1980MHz
- Anadigics - AWT6278RM20P8 - 1850MHz - 1910MHz
- Anadigics - AWT6273RM20P8 - 824MHz - 849MHz
- Bluetooth - Texas Instruments - BRF6300C - Single Chip Solution, V2.0 + Enhanced Data Rate
- WLAN - Texas Instruments - WL1251 - WLAN Baseband - Single-Chip, 802.11b/g, Wilink 4.0, 90nm
- Module - Manufacturer Unknown
- Image sensor - Samsung - S5K3C1FX03 - 3.0 MP, CMOS, 1/3.2' Format - 2.25 um x 2.25 um Pixel Size, 4.60mm x 3.45mm Active Image Area
- 2.8' Diagonal, 65K Color TFT, 240 x 320 Pixels